Kohesi Bond’s superior products are used for circuit board assembly, die-attach, potting, encapsulation and conformal coating applications in the electronics industry. They offer superior strength, thermal conductivity, electrical conductivity, electrical insulation, resist extreme temperatures and provide stress free adhesion. Our products are available in a wide variety of packaging options, suitable for manual, semi-automatic and automatic dispensing. Kohesi Bond has closely worked with engineers from the electronics industry to develop reliable products that offer superior performance. Contact us today to find your electronic adhesive.