Type of Advanced Properties of Adhesives, Sealants and Coatings
Kohesi Bond tailor-makes adhesives, sealants, coatings, potting and encapsulation compounds in a wide range of viscosities. The flow properties range from very low (< 300 cps) to extremely high (> 1 million cps). We can design products to meet exact end use viscosity requirements. Low Viscosity products are extremely crucial in applications with tight clearances, gap filling, conformal coatings and impregnation applications. The excellent flow of the adhesive makes it easy to evenly fill gaps and uniformly coat substrates with consistent thickness. Their self levelling and gap filling properties make them ideal for use in casting or impregnating porous substrates. Medium Viscosity products provide uniform bond line along with easy of dispensing. They can be applied manually with a brush or even dispensed automatically from a syringe. These products are available as filled as well as unfilled systems. They conform extremely well to the different shapes and offer consistent process control. Non-drip Viscosity products are ideal for use on vertical surfaces and for large gap filling applications. They offer excellent process controlled and they can be customized to not flow even on addition of some heat. These systems offer excellent adhesion with any sagging.
Popular Products
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KB 1372 LP
Kohesi Bond KB 1372 LP is a two component, heat curing epoxy system suitable for bonding, sealing, coating and encapsulation. It has a favorable 100:25 (Part A: Part B) mix ratio by weight. This unique epoxy system offers remarkable adhesion to a variety of substrates, such as metals, composites, glass, ceramics, most plastics and rubbers.
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KB 1613 RLV
Kohesi Bond KB 1613 RLV is a true single component system that requires no mixing and cures hard at elevated temperatures. Although it requires a minimum temperature of 120°C for curing (at which it cures extraordinarily fast), it can achieve even faster cures at elevated temperatures.
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TUF 1613 HT-SM
Kohesi Bond TUF 1613 HT-SM is a true single component system that requires no mixing and cures hard at elevated temperatures. Although it requires a minimum temperature of 120°C for curing (at which it cures extraordinarily fast), it can achieve even faster cures at higher temperatures.
Kohesi Bond manufactures a wide range of adhesives, sealants, coatings, potting and encapsulation compounds that are available in varying hardnesses. The hardness of epoxies and related compounds is typically measured on a Shore scale. ASTM D2240 is the test standard that defines this test method. The product to be tested is first casted and then tested using either a Shore A or a Shore D hardness tester. Shore A hardness tester is typically used for softer materials, whereas Shore D tester is typically used for harder materials. Both Shore A and Shore D hardnesses range from 0 to 100 in an increasing order of hardness. Our products can be tailored to meet your exact hardness requirements.
Popular Products
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KB 1031 ATHT-LO
Kohesi Bond KB 1031 ATHT-LO is a two component, highly toughened epoxy system suitable for bonding, sealing and coating applications. It has a convenient 1:1 (Part A: Part B) mix ratio by weight. Remarkably, it offers excellent peel strength and is capable of passing NASA low outgassing test.
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KB 10473 FL
Kohesi Bond KB 10473 FL is a two component, room temperature curing epoxy system suitable for bonding, sealing, potting and encapsulation. It has a convenient 1:1 (Part A: Part B) mix ratio by weight. This unique epoxy system offers remarkable flexibility and peel strength. It readily cures at room temperature and can achieve faster cures at elevated temperatures.
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KB 1452 HT-2AO
Kohesi Bond KB 1452 HT-2AO is an exclusive two component epoxy system suitable for bonding, sealing, coating, potting and encapsulation applications. It has a favorable 100:40 (Part A: Part B) mix ratio by weight. Remarkably, it offers excellent thermal conductivity and an extremely low coefficient of thermal expansion (CTE). The optimal cure schedule is an overnight room temperature set-up followed by a heat cure at 70°C – 90°C for 3 – 5 hours.
Abrasion refers to scratching or wearing or removing of a substance due to it being rubbed against a harder material. Kohesi Bond specializes in formulating abrasion and wear resistant epoxy based compounds. These coatings offer phenomenal resistance from fatigue and scuffing. This is typically achieved by filling the epoxy with highly abrasion resistant fillers. These products are widely used in the oil and gas industry, slurry lines, pipelines and vibrating screens. We can customize each product to meet exact specification requirements.
Popular Products
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KB 1040 QF
Kohesi Bond KB 1040 QF is a two component, room temperature curing epoxy system suitable for bonding, sealing, coating, potting and encapsulation. It has a favorable 4:1 (Part A: Part B) mix ratio by weight. This unique quartz filled epoxy system offers remarkable adhesion to a variety of substrates, such as metals, composites, glass, ceramics, most plastics and rubbers.
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KB 1631 AOLV-1
Kohesi Bond KB 1631 AOLV-1 is a two component epoxy system suitable for bonding, sealing, coating, potting and encapsulation applications. It offers a favorable one to one mix ratio by weight or volume. In addition, it has a long open time, a low exotherm and good flow properties when mixed, making it ideal for potting and encapsulating. This epoxy system readily cures at room temperature and can achieve faster cures at elevated temperatures.
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TUF 1820 ANHT
Kohesi Bond TUF 1820 ANHT is a toughened, single component epoxy system that offers phenomenal thermal conductivity while maintaining its superior electrical insulation properties. It requires no mixing and offers an unlimited working life at room temperature.
Kohesi Bond’s dimensionally stable adhesives, sealants, coatings, potting and encapsulation compounds are designed for reliable and consistent performance in various industries. These products hold up to extreme temperatures, chemicals, shock, vibrations and yet maintain excellent adhesion. They are commonly employed in semiconductor and opto-electronic packaging, switch gears, potting of electrical sensors and similar applications.
Popular Products
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KB 1040
Kohesi Bond KB 1040 is a two component, room temperature curing epoxy system suitable for bonding, sealing, potting and encapsulation. It has a favorable 4:1 (Part A: Part B) mix ratio by weight. This unique epoxy system offers remarkable adhesion to a variety of substrates, such as metals, glass, ceramics, most plastics and rubbers.
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KB 1631 ANHT
Kohesi Bond KB 1631 ANHT is a two component, room temperature epoxy system suitable for bonding, sealing and coating. It has a very convenient 1:1 (Part A: Part B) mix ratio by weight or volume. Primarily, it offers stellar thermal conductivity, making it ideal for heat transfer applications. This epoxy system readily cures at room temperature and can achieve faster cures at elevated temperatures.
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TUF 1820 AOHT
TUF 1820 AOHT is a toughened single component system that offers very good thermal conductivity and it is cryogenically serviceable. Owing to its stunning mechanical strength properties (tensile lap shear strength of > 3,800 psi), it is commonly used for bonding and sealing applications.
Kohesi Bond’s vibration, impact and shock resistant adhesives bond extremely well to similar and dissimilar substrates. These highly toughened systems offer excellent peel strength and can hold up well to repeated cycles of mechanical stress. Our one and two component adhesives, sealants and coatings are commonly used in aerospace, electronics, medical, automotive and oil and gas industries. These industries require the adhesive to bond well while holding up to periodic vibrations, shocks and impacts.
Popular Products
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KB 1031 AT-2LO
KB 1031 AT-2LO can withstand severe thermal shocks and cycling even at cryogenic temperatures. It offers an extensive serviceable temperature range of 4K (-269.15°C) to +120°C. It is a phenomenal adhesive that fosters outstanding physical strength properties and yet consolidates high peel strength and elongation.
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KB 1031 ATFL-N
Kohesi Bond KB 1031 ATFL-N is a two component, highly flexibilized, nickel filled epoxy system suitable for bonding and sealing. It has a convenient 1:1 (Part A: Part B) mix ratio by weight or volume. Firstly, it offers very good electrical conductivity and a first-rate peel strength.
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TUF 1452 HT-2
Kohesi Bond TUF 1452 HT-2 is a two component, room temperature curing epoxy system suitable for bonding, sealing, potting and encapsulation. It has a favorable 100:40 (Part A: Part B) mix ratio by weight or 100:50 (Part A: Part B) mix ratio by volume. This unique epoxy system offers remarkable adhesion to wide variety of substrates including metals, ceramics, most plastics and glass.
Kohesi Bond manufactures an array of low stress adhesives that offer excellent elongation and a low modulus of elasticity. These epoxies are especially useful for bonding, sealing, coating or potting of sensitive components. Cracking and delamination during thermal cycling or mechanical loading occurs commonly between substrates with different coefficients of thermal expansion. Our low stress epoxy compounds offer excellent adhesion between similar and dissimilar substrates. They prevent stress cracking and fractures by dissipating the stress. In addition they offer low shrinkage, electrical and thermal conductivity, electrical and thermal insulation, chemical resistance and are capable of meeting various industrial standards. Our low stress epoxies are commonly used in electronic, electro-optic, optical fiber, photonic and optical industries.
Popular Products
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KB 1031 AT-2LO
KB 1031 AT-2LO can withstand severe thermal shocks and cycling even at cryogenic temperatures. It offers an extensive serviceable temperature range of 4K (-269.15°C) to +120°C. It is a phenomenal adhesive that fosters outstanding physical strength properties and yet consolidates high peel strength and elongation.
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KB 10473 FL
Kohesi Bond KB 10473 FL is a two component, room temperature curing epoxy system suitable for bonding, sealing, potting and encapsulation. It has a convenient 1:1 (Part A: Part B) mix ratio by weight. This unique epoxy system offers remarkable flexibility and peel strength. It readily cures at room temperature and can achieve faster cures at elevated temperatures.
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KB 10473 FLAO
Kohesi Bond KB 10473 FLAO is a two component, room temperature curing epoxy system suitable for bonding, sealing, potting and encapsulation. It has a convenient 1:1 (Part A: Part B) mix ratio by weight. This unique epoxy system offers remarkable flexibility and peel strength.
Kohesi Bond’s acoustic grade adhesives, sealants, coatings, potting and encapsulation compounds are frequently employed in sound dampening and amplification applications. Acoustic damping is critical in Hemholtz type resonators, noise canceling devices and sound proofing electronic applications. Rubberised epoxies offer ideal noise dampening properties. Other applications involving transducers and piezoelectronics used in underwater sonar, hearing aids and pulse receivers would require acoustic amplification. These special applications require very different types of filled epoxies. Kohesi Bond’s ceramic and metal filled epoxies offer first-rate acoustic amplification. Specialty fillers such as tungsten can also be used for this purpose. We can customize each product to meet exact specification requirements.
Popular Products
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KB 1031 AT-2LO
KB 1031 AT-2LO can withstand severe thermal shocks and cycling even at cryogenic temperatures. It offers an extensive serviceable temperature range of 4K (-269.15°C) to +120°C. It is a phenomenal adhesive that fosters outstanding physical strength properties and yet consolidates high peel strength and elongation.
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KB 1040 CTE-LO
Kohesi Bond KB 1040 CTE-LO is an exclusive two component epoxy system suitable for bonding, sealing, coating and encapsulation applications. It has a favorable 10:1 (Part A: Part B) mix ratio by weight. Remarkably, it offers extremely low coefficient of thermal expansion (CTE) and is capable of passing NASA low outgassing test.
-
TUF 1820 AOHT
TUF 1820 AOHT is a toughened single component system that offers very good thermal conductivity and it is cryogenically serviceable. Owing to its stunning mechanical strength properties (tensile lap shear strength of > 3,800 psi), it is commonly used for bonding and sealing applications.
Kohesi Bond tailor-makes adhesives, sealants, coatings, potting and encapsulation compounds in a wide range of viscosities. The flow properties range from very low (< 300 cps) to extremely high (> 1 million cps). We can design products to meet exact end use viscosity requirements.
Low Viscosity products are extremely crucial in applications with tight clearances, gap filling, conformal coatings and impregnation applications. The excellent flow of the adhesive makes it easy to evenly fill gaps and uniformly coat substrates with consistent thickness. Their self levelling and gap filling properties make them ideal for use in casting or impregnating porous substrates.
Medium Viscosity products provide uniform bond line along with easy of dispensing. They can be applied manually with a brush or even dispensed automatically from a syringe. These products are available as filled as well as unfilled systems. They conform extremely well to the different shapes and offer consistent process control.
Non-drip Viscosity products are ideal for use on vertical surfaces and for large gap filling applications. They offer excellent process controlled and they can be customized to not flow even on addition of some heat. These systems offer excellent adhesion with any sagging.
-
KB 1372 LP
Kohesi Bond KB 1372 LP is a two component, heat curing epoxy system suitable for bonding, sealing, coating and encapsulation. It has a favorable 100:25 (Part A: Part B) mix ratio by weight. This unique epoxy system offers remarkable adhesion to a variety of substrates, such as metals, composites, glass, ceramics, most plastics and rubbers.
-
KB 1613 RLV
Kohesi Bond KB 1613 RLV is a true single component system that requires no mixing and cures hard at elevated temperatures. Although it requires a minimum temperature of 120°C for curing (at which it cures extraordinarily fast), it can achieve even faster cures at elevated temperatures.
-
TUF 1613 HT-SM
Kohesi Bond TUF 1613 HT-SM is a true single component system that requires no mixing and cures hard at elevated temperatures. Although it requires a minimum temperature of 120°C for curing (at which it cures extraordinarily fast), it can achieve even faster cures at higher temperatures.
-
KB 1031 ATHT-LO
Kohesi Bond KB 1031 ATHT-LO is a two component, highly toughened epoxy system suitable for bonding, sealing and coating applications. It has a convenient 1:1 (Part A: Part B) mix ratio by weight. Remarkably, it offers excellent peel strength and is capable of passing NASA low outgassing test.
-
KB 10473 FL
Kohesi Bond KB 10473 FL is a two component, room temperature curing epoxy system suitable for bonding, sealing, potting and encapsulation. It has a convenient 1:1 (Part A: Part B) mix ratio by weight. This unique epoxy system offers remarkable flexibility and peel strength. It readily cures at room temperature and can achieve faster cures at elevated temperatures.
-
KB 1452 HT-2AO
Kohesi Bond KB 1452 HT-2AO is an exclusive two component epoxy system suitable for bonding, sealing, coating, potting and encapsulation applications. It has a favorable 100:40 (Part A: Part B) mix ratio by weight. Remarkably, it offers excellent thermal conductivity and an extremely low coefficient of thermal expansion (CTE). The optimal cure schedule is an overnight room temperature set-up followed by a heat cure at 70°C – 90°C for 3 – 5 hours.
-
KB 1040 QF
Kohesi Bond KB 1040 QF is a two component, room temperature curing epoxy system suitable for bonding, sealing, coating, potting and encapsulation. It has a favorable 4:1 (Part A: Part B) mix ratio by weight. This unique quartz filled epoxy system offers remarkable adhesion to a variety of substrates, such as metals, composites, glass, ceramics, most plastics and rubbers.
-
KB 1631 AOLV-1
Kohesi Bond KB 1631 AOLV-1 is a two component epoxy system suitable for bonding, sealing, coating, potting and encapsulation applications. It offers a favorable one to one mix ratio by weight or volume. In addition, it has a long open time, a low exotherm and good flow properties when mixed, making it ideal for potting and encapsulating. This epoxy system readily cures at room temperature and can achieve faster cures at elevated temperatures.
-
TUF 1820 ANHT
Kohesi Bond TUF 1820 ANHT is a toughened, single component epoxy system that offers phenomenal thermal conductivity while maintaining its superior electrical insulation properties. It requires no mixing and offers an unlimited working life at room temperature.
-
KB 1040
Kohesi Bond KB 1040 is a two component, room temperature curing epoxy system suitable for bonding, sealing, potting and encapsulation. It has a favorable 4:1 (Part A: Part B) mix ratio by weight. This unique epoxy system offers remarkable adhesion to a variety of substrates, such as metals, glass, ceramics, most plastics and rubbers.
-
KB 1631 ANHT
Kohesi Bond KB 1631 ANHT is a two component, room temperature epoxy system suitable for bonding, sealing and coating. It has a very convenient 1:1 (Part A: Part B) mix ratio by weight or volume. Primarily, it offers stellar thermal conductivity, making it ideal for heat transfer applications. This epoxy system readily cures at room temperature and can achieve faster cures at elevated temperatures.
-
TUF 1820 AOHT
TUF 1820 AOHT is a toughened single component system that offers very good thermal conductivity and it is cryogenically serviceable. Owing to its stunning mechanical strength properties (tensile lap shear strength of > 3,800 psi), it is commonly used for bonding and sealing applications.
-
KB 1031 AT-2LO
KB 1031 AT-2LO can withstand severe thermal shocks and cycling even at cryogenic temperatures. It offers an extensive serviceable temperature range of 4K (-269.15°C) to +120°C. It is a phenomenal adhesive that fosters outstanding physical strength properties and yet consolidates high peel strength and elongation.
-
KB 1031 ATFL-N
Kohesi Bond KB 1031 ATFL-N is a two component, highly flexibilized, nickel filled epoxy system suitable for bonding and sealing. It has a convenient 1:1 (Part A: Part B) mix ratio by weight or volume. Firstly, it offers very good electrical conductivity and a first-rate peel strength.
-
TUF 1452 HT-2
Kohesi Bond TUF 1452 HT-2 is a two component, room temperature curing epoxy system suitable for bonding, sealing, potting and encapsulation. It has a favorable 100:40 (Part A: Part B) mix ratio by weight or 100:50 (Part A: Part B) mix ratio by volume. This unique epoxy system offers remarkable adhesion to wide variety of substrates including metals, ceramics, most plastics and glass.
-
KB 1031 AT-2LO
KB 1031 AT-2LO can withstand severe thermal shocks and cycling even at cryogenic temperatures. It offers an extensive serviceable temperature range of 4K (-269.15°C) to +120°C. It is a phenomenal adhesive that fosters outstanding physical strength properties and yet consolidates high peel strength and elongation.
-
KB 10473 FL
Kohesi Bond KB 10473 FL is a two component, room temperature curing epoxy system suitable for bonding, sealing, potting and encapsulation. It has a convenient 1:1 (Part A: Part B) mix ratio by weight. This unique epoxy system offers remarkable flexibility and peel strength. It readily cures at room temperature and can achieve faster cures at elevated temperatures.
-
KB 10473 FLAO
Kohesi Bond KB 10473 FLAO is a two component, room temperature curing epoxy system suitable for bonding, sealing, potting and encapsulation. It has a convenient 1:1 (Part A: Part B) mix ratio by weight. This unique epoxy system offers remarkable flexibility and peel strength.
-
KB 1031 AT-2LO
KB 1031 AT-2LO can withstand severe thermal shocks and cycling even at cryogenic temperatures. It offers an extensive serviceable temperature range of 4K (-269.15°C) to +120°C. It is a phenomenal adhesive that fosters outstanding physical strength properties and yet consolidates high peel strength and elongation.
-
KB 1040 CTE-LO
Kohesi Bond KB 1040 CTE-LO is an exclusive two component epoxy system suitable for bonding, sealing, coating and encapsulation applications. It has a favorable 10:1 (Part A: Part B) mix ratio by weight. Remarkably, it offers extremely low coefficient of thermal expansion (CTE) and is capable of passing NASA low outgassing test.
-
TUF 1820 AOHT
TUF 1820 AOHT is a toughened single component system that offers very good thermal conductivity and it is cryogenically serviceable. Owing to its stunning mechanical strength properties (tensile lap shear strength of > 3,800 psi), it is commonly used for bonding and sealing applications.