Industrial Certifications
Along with our team of experts and our dedication to superior quality, Kohesi Bond manufactures industry-ready products that meet the highest standards. Our leading adhesives, sealants, coatings, potting and encapsulation compounds are capable of passing severe test requirements set by various industries. Upon request, we can send our products to independent laboratories for testing and certification. These reliable and high performing products are extensively used in the aerospace, electronics, oil and gas, medical, optical and food industries.
Industrial Certifications
STM E-595 test standard was developed by NASA for evaluating the low outgassing properties of adhesives, sealants, coatings, potting and encapsulation compounds. This special test was designed in order to determine the usefulness of a product for space and high vacuum applications. In addition, Kohesi Bond’s specialty products that are capable of passing this test are also employed in high-end optical and electro-optical applications. Test Method: This uncomplicated test begins by first conditioning the sample in a 50% relative humidity chamber for 24 hours. The sample is then placed in a vacuum test chamber at 125°C and a minimum vacuum of 5 × 10-5 torr. The volatiles outgassing the sample are collected on a collector plate cooled at 25°C during this time. The sample and the condensate are then weighed to determine the following: CVCM: The amount of collected volatile condensable materials (CVCM) on the collector plate. TML: The amount of total mass loss (TML) by the sample WVR: The amount of water vapor regained (WVR) by the sample The material is said to pass or fail the test based on the following conditions: CVCM < 0.1% and TML < 1% – Pass CVCM < 0.1% and TML > 1% – Pass if TML – WVR <1% CVCM > 0.1% or TML – WVR > 1% – Fail
Popular Products
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KB 1031 AT-2LO
KB 1031 AT-2LO can withstand severe thermal shocks and cycling even at cryogenic temperatures. It offers an extensive serviceable temperature range of 4K (-269.15°C) to +120°C. It is a phenomenal adhesive that fosters outstanding physical strength properties and yet consolidates high peel strength and elongation.
-
KB 1372-LO
Kohesi Bond KB 1372-LO is a two component, room heat curing epoxy system suitable for bonding, sealing, and coating. It has a convenient 10:1 (Part A: Part B) mix ratio by weight. This unique epoxy system offers remarkable\y high glass transition temperature (Tg) of > 172°C. It rapidly cures at moderately elevated temperatures and can achieve even faster cures at higher temperatures.
-
TUF 1820 HTS
TUF 1820HTS is a silver filled, single component, heat curing epoxy system. It offers excellent electrical conductivity (volume resistivity of < 0.005 ohm-cm). Also, this product is cryogenically serviceable.
Kohesi Bond formulates a complete range of adhesives, sealants, coatings, potting and encapsulation compounds that are designed specifically for use in the medical Industry. Our specialty systems are capable of passing USP Class VI test requirements. These systems can withstand multiple cycles of sterilization and offer phenomenal adhesion at high and low temperatures. We offer a variety products that can be used in reusable and disposable devices. Passing USP Class VI testing strongly implies that our products will not be an obstacle when your devices are submitted to FDA for testing. However, special attention and care must be taken to ensure all FDA regulations regarding the use of adhesives in medical devices and all their components are met.
Popular Products
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KB 1031 AT-S
Kohesi Bond KB 1031 AT-S is a two component, silver filled, electrically conductive epoxy system suitable for bonding and sealing. It has a convenient 1:1 (Part A: Part B) mix ratio by weight. It offers unprecedentedly low volume resistivity (< 10-3 ohm-cm) and remarkably high thermal conductivity.
-
KB 1452 HT-2
KB 1452 HT-2 is a two part system suitable for bonding, sealing, coating, potting and encapsulation applications. Its unique capability of passing USP Class VI testing makes it ideal for use in the medical industry. It can withstand repeated cycles of medical sterilization.
-
KB 1613 HT
KB 1613 HT is a one component heat curing epoxy system, that is typically used for bonding, sealing and coating applications. It offers rapid cures at elevated temperatures (5 – 10 minutes at 150°C) as well as outstanding physical strength properties.
The U.S. Food and Drug Administration (FDA) has established two standards for adhesives to be used as coatings that are intended for use in producing, manufacturing, packaging, processing, transporting or holding food. These two standards are specified as follows: FDA CFR 175.105 test standard specifies the list of chemicals that are safe to be used in the formulation of epoxy adhesives, sealants and coatings. Products containing these chemicals comply with the FDA CFR 175.105 test standard and are typically used for incidental or accidental food processing and contact. FDA CFR 175.300 is a more stringent and a precise standard established by the U.S. FDA. Adhesives, sealants and coatings are tested by individual laboratories to determine the amount of extractables in various solvents at elevated temperatures and are also tested for their toxicology. If the amount of extractables is less than 0.05 mg/ in2, the epoxy is said to have passed the FDA CFR 175.300 test standard and can be used for a more continued contact with food articles. Kohesi Bond offers a variety of epoxy based, food safe products that are commonly used in the food industry. However, special care should be taken to ensure that all the FDA regulations regarding the use of adhesives in your food application are met.
Popular Products
-
KB 1040 P
Kohesi Bond KB 1040 P is a two component, room temperature curing epoxy system suitable for bonding, sealing, potting and encapsulation. It has a favorable 4:1 (Part A: Part B) mix ratio by weight. This unique epoxy system offers remarkable adhesion to plastics like polycarbonates and acrylics among others without any stress cracking.
-
KB 1452 HT-2
KB 1452 HT-2 is a two part system suitable for bonding, sealing, coating, potting and encapsulation applications. Its unique capability of passing USP Class VI testing makes it ideal for use in the medical industry. It can withstand repeated cycles of medical sterilization.
UL 94V-0: Underwriters Laboratories (UL) rates epoxies for their self extinguishing and flame retardant properties by performing extensive testing. These epoxies are useful in special potting and encapsulation applications and are rated up to 90°C. Kohesi Bond formulates customized epoxies that are capable of passing the most stringent UL flame retardant rating i.e. UL 94V-0. FAR 25.853 (a) is a standard for flame retardancy as defined by the Federal Aviation Regulation to test a material’s compliance for use in airline cabin, cargo and interiors. This test involves burning a cured sample at a specific angle for a defined amount of time. The material’s flame retardancy is then measured in terms of the burn time, length and rate. The test is performed in both horizontal and vertical positions. The vertical test specification is more challenging as compared to the horizontal test specifications. However, depending on your application either one of the test specifications might be sufficient. Kohesi Bond offers innovative products that are capable of meeting these requirements.
Popular Products
-
KB 1600 FR-V
Kohesi Bond KB 1600 FR-V is a two component epoxy system that offers a convenient to use mix ratio of 1:1 by weight. This flame retardant epoxy is capable of passing the vertical burn test specifications as per Amendment 25-116 and Part 25 Appendix F of the FAR standards.
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KB 1631 FR-2
KB 1631 FR-2 is an easy to use two component system, suitable for potting, encapsulation and casting applications. This product’s noteworthy features are its capability of passing UL 94 V-0 testing, its low smoke generation and that it contains a non-halogenated filler.
RoHS stands for Restriction of Hazardous Substances. This directive was initiated in the European Union and restricts the use of six hazardous substances to exceptionally low ppm (parts per million) levels, to ensure the health and safety of individuals and the environment. The six restricted substance include:
- Lead (Pb)
- Mercury (Hg)
- Cadmium (Cd)
- Hexavalent Chromium (Cr VI)
- Polybrominated Biphenyls (PBB)
- Polybrominated Diphenyl Ethers (PBDE)
All Kohesi Bond products are RoHS compliant and do not contain any of the substances mentioned above.
Kohesi Bond is committed to formulating environmentally safe adhesives, sealants, coatings, potting and encapsulation compounds. Halogens being very reactive, are capable of releasing toxic and harmful gases. This poses a concern with environmental and health safety. International Electrochemical Commission (IEC) has established a standard called IEC 61249-2-21 that defines halogen-free as follows:
- Chlorine Content ≤ 900 ppm
- Bromine Content ≤ 900 ppm
- Total Halogen Content ≤ 1500 ppm
- Hexavalent Chromium (Cr VI)
- Polybrominated Biphenyls (PBB)
- Polybrominated Diphenyl Ethers (PBDE)
Kohesi Bond manufactures and formulates one as well as two component products that meet the IEC 61249-2-21 standard. Owing to the concerns, halogen-free products are crucial in various electronic, aerospace and optical applications.
Popular Products
-
KB 1631 HTC-1
KB 1631 HTC-1 is a high performance two part epoxy suitable for bonding and sealing applications. This products offers stellar thermal conductivity of 1.5 – 1.6 W/m/K, it is cryogenically serviceable and it is capable of passing NASA standards for low outgassing (ASTM E-595).
-
TUF 1820 AOHT
TUF 1820 AOHT is a toughened single component system that offers very good thermal conductivity and it is cryogenically serviceable. Owing to its stunning mechanical strength properties (tensile lap shear strength of > 3,800 psi), it is commonly used for bonding and sealing applications.
Along with our team of experts and our dedication to superior quality, Kohesi Bond manufactures industry-ready products that meet the highest standards. Our leading adhesives, sealants, coatings, potting and encapsulation compounds are capable of passing severe test requirements set by various industries. Upon request, we can send our products to independent laboratories for testing and certification. These reliable and high performing products are extensively used in the aerospace, electronics, oil and gas, medical, optical and food industries.
ASTM E-595 test standard was developed by NASA for evaluating the low outgassing properties of adhesives, sealants, coatings, potting and encapsulation compounds. This special test was designed in order to determine the usefulness of a product for space and high vacuum applications. In addition, Kohesi Bond’s specialty products that are capable of passing this test are also employed in high-end optical and electro-optical applications.
Test Method:
This uncomplicated test begins by first conditioning the sample in a 50% relative humidity chamber for 24 hours. The sample is then placed in a vacuum test chamber at 125°C and a minimum vacuum of 5 × 10-5 torr. The volatiles outgassing the sample are collected on a collector plate cooled at 25°C during this time. The sample and the condensate are then weighed to determine the following:
CVCM: The amount of collected volatile condensable materials (CVCM) on the collector plate.
TML: The amount of total mass loss (TML) by the sample
WVR: The amount of water vapor regained (WVR) by the sample
The material is said to pass or fail the test based on the following conditions:
CVCM < 0.1% and TML < 1% – Pass
CVCM < 0.1% and TML > 1% – Pass if TML – WVR <1%
CVCM > 0.1% or TML – WVR > 1% – Fail
-
KB 1031 AT-2LO
KB 1031 AT-2LO can withstand severe thermal shocks and cycling even at cryogenic temperatures. It offers an extensive serviceable temperature range of 4K (-269.15°C) to +120°C. It is a phenomenal adhesive that fosters outstanding physical strength properties and yet consolidates high peel strength and elongation.
-
KB 1372-LO
Kohesi Bond KB 1372-LO is a two component, room heat curing epoxy system suitable for bonding, sealing, and coating. It has a convenient 10:1 (Part A: Part B) mix ratio by weight. This unique epoxy system offers remarkable\y high glass transition temperature (Tg) of > 172°C. It rapidly cures at moderately elevated temperatures and can achieve even faster cures at higher temperatures.
-
TUF 1820 HTS
TUF 1820HTS is a silver filled, single component, heat curing epoxy system. It offers excellent electrical conductivity (volume resistivity of < 0.005 ohm-cm). Also, this product is cryogenically serviceable.
-
KB 1031 AT-S
Kohesi Bond KB 1031 AT-S is a two component, silver filled, electrically conductive epoxy system suitable for bonding and sealing. It has a convenient 1:1 (Part A: Part B) mix ratio by weight. It offers unprecedentedly low volume resistivity (< 10-3 ohm-cm) and remarkably high thermal conductivity.
-
KB 1452 HT-2
KB 1452 HT-2 is a two part system suitable for bonding, sealing, coating, potting and encapsulation applications. Its unique capability of passing USP Class VI testing makes it ideal for use in the medical industry. It can withstand repeated cycles of medical sterilization.
-
KB 1613 HT
KB 1613 HT is a one component heat curing epoxy system, that is typically used for bonding, sealing and coating applications. It offers rapid cures at elevated temperatures (5 – 10 minutes at 150°C) as well as outstanding physical strength properties.
The U.S. Food and Drug Administration (FDA) has established two standards for adhesives to be used as coatings that are intended for use in producing, manufacturing, packaging, processing, transporting or holding food. These two standards are specified as follows:
FDA CFR 175.105 test standard specifies the list of chemicals that are safe to be used in the formulation of epoxy adhesives, sealants and coatings. Products containing these chemicals comply with the FDA CFR 175.105 test standard and are typically used for incidental or accidental food processing and contact.
FDA CFR 175.300 is a more stringent and a precise standard established by the U.S. FDA. Adhesives, sealants and coatings are tested by individual laboratories to determine the amount of extractables in various solvents at elevated temperatures and are also tested for their toxicology. If the amount of extractables is less than 0.05 mg/ in2, the epoxy is said to have passed the FDA CFR 175.300 test standard and can be used for a more continued contact with food articles.
Kohesi Bond offers a variety of epoxy based, food safe products that are commonly used in the food industry. However, special care should be taken to ensure that all the FDA regulations regarding the use of adhesives in your food application are met.
-
KB 1040 P
Kohesi Bond KB 1040 P is a two component, room temperature curing epoxy system suitable for bonding, sealing, potting and encapsulation. It has a favorable 4:1 (Part A: Part B) mix ratio by weight. This unique epoxy system offers remarkable adhesion to plastics like polycarbonates and acrylics among others without any stress cracking.
-
KB 1452 HT-2
KB 1452 HT-2 is a two part system suitable for bonding, sealing, coating, potting and encapsulation applications. Its unique capability of passing USP Class VI testing makes it ideal for use in the medical industry. It can withstand repeated cycles of medical sterilization.
UL 94V-0: Underwriters Laboratories (UL) rates epoxies for their self extinguishing and flame retardant properties by performing extensive testing. These epoxies are useful in special potting and encapsulation applications and are rated up to 90°C. Kohesi Bond formulates customized epoxies that are capable of passing the most stringent UL flame retardant rating i.e. UL 94V-0.
FAR 25.853 (a) is a standard for flame retardancy as defined by the Federal Aviation Regulation to test a material’s compliance for use in airline cabin, cargo and interiors. This test involves burning a cured sample at a specific angle for a defined amount of time. The material’s flame retardancy is then measured in terms of the burn time, length and rate. The test is performed in both horizontal and vertical positions. The vertical test specification is more challenging as compared to the horizontal test specifications. However, depending on your application either one of the test specifications might be sufficient. Kohesi Bond offers innovative products that are capable of meeting these requirements.
-
KB 1600 FR-V
Kohesi Bond KB 1600 FR-V is a two component epoxy system that offers a convenient to use mix ratio of 1:1 by weight. This flame retardant epoxy is capable of passing the vertical burn test specifications as per Amendment 25-116 and Part 25 Appendix F of the FAR standards.
-
KB 1631 FR-2
KB 1631 FR-2 is an easy to use two component system, suitable for potting, encapsulation and casting applications. This product’s noteworthy features are its capability of passing UL 94 V-0 testing, its low smoke generation and that it contains a non-halogenated filler.
RoHS stands for Restriction of Hazardous Substances. This directive was initiated in the European Union and restricts the use of six hazardous substances to exceptionally low ppm (parts per million) levels, to ensure the health and safety of individuals and the environment. The six restricted substance include:
- Lead (Pb)
- Mercury (Hg)
- Cadmium (Cd)
- Hexavalent Chromium (Cr VI)
- Polybrominated Biphenyls (PBB)
- Polybrominated Diphenyl Ethers (PBDE)
All Kohesi Bond products are RoHS compliant and do not contain any of the substances mentioned above.
Kohesi Bond is committed to formulating environmentally safe adhesives, sealants, coatings, potting and encapsulation compounds. Halogens being very reactive, are capable of releasing toxic and harmful gases. This poses a concern with environmental and health safety. International Electrochemical Commission (IEC) has established a standard called IEC 61249-2-21 that defines halogen-free as follows:
- Chlorine Content ≤ 900 ppm
- Bromine Content ≤ 900 ppm
- Total Halogen Content ≤ 1500 ppm
- Hexavalent Chromium (Cr VI)
- Polybrominated Biphenyls (PBB)
- Polybrominated Diphenyl Ethers (PBDE)
Kohesi Bond manufactures and formulates one as well as two component products that meet the IEC 61249-2-21 standard. Owing to the concerns, halogen-free products are crucial in various electronic, aerospace and optical applications.
-
KB 1631 HTC-1
KB 1631 HTC-1 is a high performance two part epoxy suitable for bonding and sealing applications. This products offers stellar thermal conductivity of 1.5 – 1.6 W/m/K, it is cryogenically serviceable and it is capable of passing NASA standards for low outgassing (ASTM E-595).
-
TUF 1820 AOHT
TUF 1820 AOHT is a toughened single component system that offers very good thermal conductivity and it is cryogenically serviceable. Owing to its stunning mechanical strength properties (tensile lap shear strength of > 3,800 psi), it is commonly used for bonding and sealing applications.