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KB 1031 ATHT-LO
Kohesi Bond KB 1031 ATHT-LO is a two component, highly toughened epoxy system suitable for bonding, sealing and coating applications. It has a convenient 1:1 (Part A: Part B) mix ratio by weight. Remarkably, it offers excellent peel strength and is capable of passing NASA low outgassing test.
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KB 1031 SPLV-6
Kohesi Bond KB 1031 SPLV-6 is a two component epoxy system for bonding, sealing, coating and encapsulating. It has a convenient 1:1 (Part A: Part B) mix ratio by weight or volume. This high performance specialty product offers a unique combination of low viscosity, low exotherm and very long working life.
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KB 1631 AOLV-1
Kohesi Bond KB 1631 AOLV-1 is a two component epoxy system suitable for bonding, sealing, coating, potting and encapsulation applications. It offers a favorable one to one mix ratio by weight or volume. In addition, it has a long open time, a low exotherm and good flow properties when mixed, making it ideal for potting and encapsulating. This epoxy system readily cures at room temperature and can achieve faster cures at elevated temperatures.
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TUF 1613 HT-DA
TUF 1613 HT-DA is a true one part system that is specially formulated for die attach applications. It has an ideal dispensing profile with no tailing. In addition to superior electrical insulation, it also offers phenomenal thermal conductivity of 1.4 – 1.5 W/m/K.
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TUF 1613 HT-GT
Kohesi Bond TUF 1613 HT-GT is a single component, toughened epoxy system that requires no mixing and cures rapidly at elevated temperatures. Although it requires a minimum temperature of 120°C for curing (at which it cures extraordinarily fast), it can achieve even faster cures at elevated temperatures.
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KB 1031 ATFL-N
Kohesi Bond KB 1031 ATFL-N is a two component, highly flexibilized, nickel filled epoxy system suitable for bonding and sealing. It has a convenient 1:1 (Part A: Part B) mix ratio by weight or volume. Firstly, it offers very good electrical conductivity and a first-rate peel strength.
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KB 1085-1
Kohesi Bond KB 1085-1 is a two component, graphite filled epoxy system suitable for bonding, sealing and coating. It has a favorable 100:15 (Part A: Part B) mix ratio by weight. Firstly, it offers very good electrical conductivity and a outstanding dimensional stability.
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KB 1689
Kohesi Bond KB 1689 is a two component, toughened, silver coated nickel filled epoxy system suitable for bonding and sealing. It has a convenient 1:1 (Part A: Part B) mix ratio by weight. Firstly, it offers very good electrical conductivity and very low shrinkage upon cure.
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TUF 1820 HTS
TUF 1820HTS is a silver filled, single component, heat curing epoxy system. It offers excellent electrical conductivity (volume resistivity of < 0.005 ohm-cm). Also, this product is cryogenically serviceable.
FAQs:
An electrically conductive epoxy is a specialty epoxy adhesive containing high purity metal fillers that allow the adhesive to conduct electricity. Both, one and two component epoxy adhesives are capable of conducting electricity while maintaining a strong bond between two surfaces.
Electrically conductive epoxies are widely used in applications requiring electrical conductivity for the purpose of making an electrical connection, EMI/RFI shielding or grounding. Electrically conductive epoxies are typically employed in various electronic and electrical components and semiconductor chips across aerospace, defence, medical, space, optical, electronic, automotive, and specialty OEM industries.
The thermal resistance of electrically conductive epoxy may vary depending on the epoxy formulation and the manufacturer. Kohesi Bond’s electrically conductive epoxy adhesives can withstand temperatures from 4K (-269.15°C) up to 340°C (640°F). Since these materials have good thermal cycling stability, they can withstand repeated exposure to high temperatures without degradation.
Electrically conductive epoxy can be applied manually or by using a dispensing equipment for precise application of the adhesive. Kohesi Bond offers a wide range of packaging options which include standard containers, syringes and cartridges simplifying the application process for electrically conductive epoxies.
The conductivity of an electrically conductive epoxy can vary depending on the specific formulation and the concentration of conductive filler that is used. In general, electrically conductive epoxies have a conductivity range of < 0.001 ohm-cm to 100 ohm-cm, with some custom-engineered epoxy formulations offering even higher conductivity.
The conductivity of an epoxy typically remains stable over its lifetime. However, extreme environmental ageing can affect its performance properties, including conductivity. The ageing process that affects the electrical conductivity of the adhesive includes oxidation, hydrolysis, thermal degradation, exposure to UV radiation and other environmental factors beyond the recommended exposure levels. An affected joint can see a change in conductivity levels.
Hence, it is imperative to choose an epoxy system that is custom-made for the specific application and to follow the manufacturer’s recommendations for application, curing, and storage. Kohesi Bond is leading provider of custom-formulated conductive adhesives for electronics systems.
Electrical insulating epoxy is a type of epoxy system that has high resistance to electrical conductivity and is formulated to insulate electrical components or systems from electric current.
Electrical insulating epoxy can be specifically designed to have a high glass transition temperature which provides good thermal stability to withstand repeated exposure to high temperatures without degradation. Alternatively, we also manufacture exclusive products that can withstand extremely low cryogenic temperatures down to 4K.
Generally, electrical insulating epoxies are designed to have a high volume resistivity to provide effective electrical insulation, but it can vary depending on specific formulation of the material and the conditions under which it is tested. Typically volume resistivity of an insulating epoxy is > 10e14 ohm-cm at 23°C.
Generally, for an insulating epoxy product the dielectric strength is > 420 volts/ mil at 23°C at ⅛” thickness. For thinner sections the dielectric strength can be much higher > 2000 volts/mil.
Yes, electrically insulating epoxies can be formulated to offer high thermally conductivity. Typical applications include thermal interface materials, heat sink compounds, thermally conductive potting compounds or thermally conductive adhesives.If you are looking for epoxy adhesive or epoxy coating for electrical insulation, reach out to us. . Our technical experts can help you find the right thermally conductive epoxy that offers electrical insulation.
Electrically insulating epoxies can be either hard or soft based on their formulation and intended use. Some are designed to be hard, making them ideal for applications where epoxy needs to provide structural support. Others are designed to be soft, making them ideal for applications where epoxy needs to withstand mechanical stress without cracking.