Curing Properties
Kohesi Bond custom manufactures adhesives, sealants, coatings, potting and encapsulation compounds that offer a variety of curing options. Our products can be room temperature cured or heat cured. The cure time varies with the choice of the epoxy-curing agent system and can be customized to cure longer or shorter depending on your specific requirements. For ease of processing and manufacturing, our tailor-made products offer you a choice of different curing mechanisms and cure times. They are widely employed in various electronics, aerospace, medical, oil and gas, automotive, optical and chemical industries. Our specialty adhesives are also capable of passing many industrial standards, such as NASA low outgassing (ASTM E-595), USP Class VI, UL 94 V-0 flame retardance among others.
Type of Curing Properties
Kohesi Bond offers a range of one and two component ambient temperature curing adhesives, sealants, coatings, potting and encapsulation compounds. For two component systems, the room temperature cure is initiated by mixing the resin and the hardener in the given ratio. Once the two products are mixed, an exothermic reaction occurs, that eventually cures the adhesive completely. Depending on the choice of the resin-curing agent system, the set-up time or the gel time could vary from a few minutes to a few hours or days. Additionally, the rate of cure will also depend on the thickness of the applied adhesive and the temperature. Our one component, room temperature curing systems include sodium silicate based adhesives, coatings and sealants. These non-toxic, non-flammable products offer ease of application and very good flow properties. They can be easily spread and cured at room temperature. The curing occurs due to evaporation of the water from the system. Faster cures can be achieved at elevated temperatures.
Popular Products
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KB 1040-2
Read moreKB 1040-2 is a low viscosity, optically clear epoxy system that cures readily at room temperature. In addition, it is capable of passing NASA standards for low outgassing (ASTM E-595). Also, it offers excellent resistance to a variety of acids, bases, oils, fuels and water.
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KB 1048
Read moreKohesi Bond KB 1048 is a two component, room temperature curing epoxy system suitable for bonding, sealing, potting and encapsulation. It has a favorable 1:0.33 (Part A: Part B) mix ratio by weight. This unique epoxy system offers remarkable adhesion to a variety of substrates, such as metals, glass, ceramics, most plastics and rubbers.
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KB-SS-SIL
Read moreKohesi Bond KB-SS-SIL is a silver filled, sodium silicate based coating system. Firstly, this product offers phenomenal electrical conductivity. This products offers the highest level of shielding towards electromagnetic interference (EMI) and radio frequency interference (RFI).
Kohesi Bond offers an array of one and two component heat curing epoxies. These products offer excellent adhesion to similar as well as dissimilar substrates. Also, they can withstand exposure to extreme temperatures and chemicals. Our true one component, heat curing adhesives require no mixing and cure only on exposure to elevated temperatures. These systems are latent at room temperature and start curing when exposed to specified higher temperatures. They offer an unlimited working life at room temperature. Our heat curing adhesives can be customized to meet your specific requirements.
Popular Products
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KB 1372-AO
Read moreKohesi Bond KB 1372-AO is a two component, heat curing epoxy system suitable for bonding, sealing, and coating. It has a convenient 10:1 (Part A: Part B) mix ratio by weight. This unique epoxy system offers remarkable\y high glass transition temperature (Tg) of > 172°C.
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KB 1613 RLV
Read moreKohesi Bond KB 1613 RLV is a true single component system that requires no mixing and cures hard at elevated temperatures. Although it requires a minimum temperature of 120°C for curing (at which it cures extraordinarily fast), it can achieve even faster cures at elevated temperatures.
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TUF 1613 HT-CM
Read moreKohesi Bond TUF 1613 HT-CM is a toughened, single component system that requires no mixing and cures readily at elevated temperatures. Although it requires a minimum temperature of 120°C for curing (at which it cures extraordinarily fast), it can achieve even faster cures at higher temperatures.
Kohesi Bond custom formulates specialty adhesives, sealants, coatings, potting and encapsulation compounds that are capable of offering extremely fast cures. The curing rate would vary from a few seconds to a couple of minutes. These fast or snap curing one and two component epoxies offer ease of use and are extremely critical for use in applications requiring very high productivity.
Popular Products
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KB 1151 S-1
Read moreKB 1151 S-1 is a two component, room temperature curing epoxy system suitable for bonding sealing and coating applications. It offers outstanding chemical resistance, particularly to fuels, solvents and alcohols.
-
KB 1427 HT-3
Read moreThis product’s unlikely low exotherm makes it ideal for use in potting up to 1/4 inch thicknesses. Being a one component system, it requires no mixing and provides ease of application. This epoxy system will not set-up unless heated above 100°C.
-
TUF 1613 HT-DA
Read moreTUF 1613 HT-DA is a true one part system that is specially formulated for die attach applications. It has an ideal dispensing profile with no tailing. In addition to superior electrical insulation, it also offers phenomenal thermal conductivity of 1.4 – 1.5 W/m/K.
Kohesi Bond custom manufactures adhesives, sealants, coatings, potting and encapsulation compounds that offer a variety of curing options. Our products can be room temperature cured or heat cured. The cure time varies with the choice of the epoxy-curing agent system and can be customized to cure longer or shorter depending on your specific requirements. For ease of processing and manufacturing, our tailor-made products offer you a choice of different curing mechanisms and cure times. They are widely employed in various electronics, aerospace, medical, oil and gas, automotive, optical and chemical industries. Our specialty adhesives are also capable of passing many industrial standards, such as NASA low outgassing (ASTM E-595), USP Class VI, UL 94 V-0 flame retardance among others.
Kohesi Bond offers a range of one and two component ambient temperature curing adhesives, sealants, coatings, potting and encapsulation compounds. For two component systems, the room temperature cure is initiated by mixing the resin and the hardener in the given ratio. Once the two products are mixed, an exothermic reaction occurs, that eventually cures the adhesive completely. Depending on the choice of the resin-curing agent system, the set-up time or the gel time could vary from a few minutes to a few hours or days. Additionally, the rate of cure will also depend on the thickness of the applied adhesive and the temperature.
Our one component, room temperature curing systems include sodium silicate based adhesives, coatings and sealants. These non-toxic, non-flammable products offer ease of application and very good flow properties. They can be easily spread and cured at room temperature. The curing occurs due to evaporation of the water from the system. Faster cures can be achieved at elevated temperatures.
-
KB 1040-2
Read moreKB 1040-2 is a low viscosity, optically clear epoxy system that cures readily at room temperature. In addition, it is capable of passing NASA standards for low outgassing (ASTM E-595). Also, it offers excellent resistance to a variety of acids, bases, oils, fuels and water.
-
KB 1048
Read moreKohesi Bond KB 1048 is a two component, room temperature curing epoxy system suitable for bonding, sealing, potting and encapsulation. It has a favorable 1:0.33 (Part A: Part B) mix ratio by weight. This unique epoxy system offers remarkable adhesion to a variety of substrates, such as metals, glass, ceramics, most plastics and rubbers.
-
KB-SS-SIL
Read moreKohesi Bond KB-SS-SIL is a silver filled, sodium silicate based coating system. Firstly, this product offers phenomenal electrical conductivity. This products offers the highest level of shielding towards electromagnetic interference (EMI) and radio frequency interference (RFI).
-
KB 1372-AO
Read moreKohesi Bond KB 1372-AO is a two component, heat curing epoxy system suitable for bonding, sealing, and coating. It has a convenient 10:1 (Part A: Part B) mix ratio by weight. This unique epoxy system offers remarkable\y high glass transition temperature (Tg) of > 172°C.
-
KB 1613 RLV
Read moreKohesi Bond KB 1613 RLV is a true single component system that requires no mixing and cures hard at elevated temperatures. Although it requires a minimum temperature of 120°C for curing (at which it cures extraordinarily fast), it can achieve even faster cures at elevated temperatures.
-
TUF 1613 HT-CM
Read moreKohesi Bond TUF 1613 HT-CM is a toughened, single component system that requires no mixing and cures readily at elevated temperatures. Although it requires a minimum temperature of 120°C for curing (at which it cures extraordinarily fast), it can achieve even faster cures at higher temperatures.
-
KB 1151 S-1
Read moreKB 1151 S-1 is a two component, room temperature curing epoxy system suitable for bonding sealing and coating applications. It offers outstanding chemical resistance, particularly to fuels, solvents and alcohols.
-
KB 1427 HT-3
Read moreThis product’s unlikely low exotherm makes it ideal for use in potting up to 1/4 inch thicknesses. Being a one component system, it requires no mixing and provides ease of application. This epoxy system will not set-up unless heated above 100°C.
-
TUF 1613 HT-DA
Read moreTUF 1613 HT-DA is a true one part system that is specially formulated for die attach applications. It has an ideal dispensing profile with no tailing. In addition to superior electrical insulation, it also offers phenomenal thermal conductivity of 1.4 – 1.5 W/m/K.