Curing Properties

Kohesi Bond offers a range of one and two component ambient temperature curing adhesives, sealants, coatings, potting and encapsulation compounds. For two component systems, the room temperature cure is initiated by mixing the resin and the hardener in the given ratio. Once the two products are mixed, an exothermic reaction occurs, that eventually cures the adhesive completely. Depending on the choice of the resin-curing agent system, the set-up time or the gel time could vary from a few minutes to a few hours or days. Additionally, the rate of cure will also depend on the thickness of the applied adhesive and the temperature. Our one component, room temperature curing systems include sodium silicate based adhesives, coatings and sealants. These non-toxic, non-flammable products offer ease of application and very good flow properties. They can be easily spread and cured at room temperature. The curing occurs due to evaporation of the water from the system. Faster cures can be achieved at elevated temperatures.

Kohesi Bond offers an array of one and two component heat curing epoxies. These products offer excellent adhesion to similar as well as dissimilar substrates. Also, they can withstand exposure to extreme temperatures and chemicals. Our true one component, heat curing adhesives require no mixing and cure only on exposure to elevated temperatures. These systems are latent at room temperature and start curing when exposed to specified higher temperatures. They offer an unlimited working life at room temperature. Our heat curing adhesives can be customized to meet your specific requirements.

Kohesi Bond custom formulates specialty adhesives, sealants, coatings, potting and encapsulation compounds that are capable of offering extremely fast cures. The curing rate would vary from a few seconds to a couple of minutes. These fast or snap curing one and two component epoxies offer ease of use and are extremely critical for use in applications requiring very high productivity.