Two Component Epoxy System
Two component epoxy systems are special polymer systems where the resin and the curing agent are stored in separate containers. The two components (commonly referred to as Part A and Part B) are required to be mixed in the specified mixing ratio. After mixing, the polymerization occurs readily at ambient temperatures or at elevated temperatures for faster cures. Kohesi Bond offers a wide range of two component epoxy systems with varying working lives and curing properties. The most significant advantage of these products is their ability to cure at room temperature, thus offering an array of performance properties for applications where adding heat for curing is not feasible. Our products can be customised and packaged to meet your specific requirements. Specialty packaging is also available for automated metering and mixing of the two parts, offering ease of use and higher yields.
Two Component All Products
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KB 1031 AT-2LO
Read moreKB 1031 AT-2LO can withstand severe thermal shocks and cycling even at cryogenic temperatures. It offers an extensive serviceable temperature range of 4K (-269.15°C) to +120°C. It is a phenomenal adhesive that fosters outstanding physical strength properties and yet consolidates high peel strength and elongation.
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KB 1031 AT-S
Read moreKohesi Bond KB 1031 AT-S is a two component, silver filled, electrically conductive epoxy system suitable for bonding and sealing. It has a convenient 1:1 (Part A: Part B) mix ratio by weight. It offers unprecedentedly low volume resistivity (< 10-3 ohm-cm) and remarkably high thermal conductivity.
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KB 1031 ATFL-N
Read moreKohesi Bond KB 1031 ATFL-N is a two component, highly flexibilized, nickel filled epoxy system suitable for bonding and sealing. It has a convenient 1:1 (Part A: Part B) mix ratio by weight or volume. Firstly, it offers very good electrical conductivity and a first-rate peel strength.
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KB 1031 ATHT-LO
Read moreKohesi Bond KB 1031 ATHT-LO is a two component, highly toughened epoxy system suitable for bonding, sealing and coating applications. It has a convenient 1:1 (Part A: Part B) mix ratio by weight. Remarkably, it offers excellent peel strength and is capable of passing NASA low outgassing test.
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KB 1031 SPLV-6
Read moreKohesi Bond KB 1031 SPLV-6 is a two component epoxy system for bonding, sealing, coating and encapsulating. It has a convenient 1:1 (Part A: Part B) mix ratio by weight or volume. This high performance specialty product offers a unique combination of low viscosity, low exotherm and very long working life.
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KB 1039 CRLP
Read moreKohesi Bond KB 1039 CRLP is a two component, heat curing epoxy system suitable for bonding, sealing, coating, potting and encapsulation. It has a favorable 100:65 (Part A: Part B) mix ratio by weight. This unique epoxy system offers remarkable adhesion to a variety of substrates, such as metals, composites, glass, ceramics, most plastics and rubbers.
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KB 1039 CRLP-AO
Read moreKohesi Bond KB 1039 CRLP-AO is a two component, heat curing epoxy system suitable for bonding, sealing, coating, potting and encapsulation. It has a favorable 100:65 (Part A: Part B) mix ratio by weight. This unique epoxy system offers remarkable adhesion to a variety of substrates, such as metals, composites, glass, ceramics, most plastics and rubbers.
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KB 1040
Read moreKohesi Bond KB 1040 is a two component, room temperature curing epoxy system suitable for bonding, sealing, potting and encapsulation. It has a favorable 4:1 (Part A: Part B) mix ratio by weight. This unique epoxy system offers remarkable adhesion to a variety of substrates, such as metals, glass, ceramics, most plastics and rubbers.
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KB 1040 AN-1
Read moreKohesi Bond KB 1040 AN-1 is a two component, room temperature curing epoxy system suitable for bonding, sealing, potting and encapsulation. It has a favorable 10:1 (Part A: Part B) mix ratio by weight. Remarkably, it offers stellar thermal conductivity and is capable of passing NASA low outgassing test.
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KB 1040 AOHT
Read moreKohesi Bond KB 1040 AOHT is an exclusive two component epoxy system suitable for bonding, sealing, coating, potting and encapsulation applications. It has a favorable 10:1 (Part A: Part B) mix ratio by weight. Remarkably, it offers excellent thermal conductivity and an extremely low coefficient of thermal expansion (CTE).
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KB 1040 CTE-LO
Read moreKohesi Bond KB 1040 CTE-LO is an exclusive two component epoxy system suitable for bonding, sealing, coating and encapsulation applications. It has a favorable 10:1 (Part A: Part B) mix ratio by weight. Remarkably, it offers extremely low coefficient of thermal expansion (CTE) and is capable of passing NASA low outgassing test.
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KB 1040 P
Read moreKohesi Bond KB 1040 P is a two component, room temperature curing epoxy system suitable for bonding, sealing, potting and encapsulation. It has a favorable 4:1 (Part A: Part B) mix ratio by weight. This unique epoxy system offers remarkable adhesion to plastics like polycarbonates and acrylics among others without any stress cracking.
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KB 1040 QF
Read moreKohesi Bond KB 1040 QF is a two component, room temperature curing epoxy system suitable for bonding, sealing, coating, potting and encapsulation. It has a favorable 4:1 (Part A: Part B) mix ratio by weight. This unique quartz filled epoxy system offers remarkable adhesion to a variety of substrates, such as metals, composites, glass, ceramics, most plastics and rubbers.
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KB 1040-2
Read moreKB 1040-2 is a low viscosity, optically clear epoxy system that cures readily at room temperature. In addition, it is capable of passing NASA standards for low outgassing (ASTM E-595). Also, it offers excellent resistance to a variety of acids, bases, oils, fuels and water.
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KB 10473 FL
Read moreKohesi Bond KB 10473 FL is a two component, room temperature curing epoxy system suitable for bonding, sealing, potting and encapsulation. It has a convenient 1:1 (Part A: Part B) mix ratio by weight. This unique epoxy system offers remarkable flexibility and peel strength. It readily cures at room temperature and can achieve faster cures at elevated temperatures.
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KB 10473 FLAO
Read moreKohesi Bond KB 10473 FLAO is a two component, room temperature curing epoxy system suitable for bonding, sealing, potting and encapsulation. It has a convenient 1:1 (Part A: Part B) mix ratio by weight. This unique epoxy system offers remarkable flexibility and peel strength.
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KB 1048
Read moreKohesi Bond KB 1048 is a two component, room temperature curing epoxy system suitable for bonding, sealing, potting and encapsulation. It has a favorable 1:0.33 (Part A: Part B) mix ratio by weight. This unique epoxy system offers remarkable adhesion to a variety of substrates, such as metals, glass, ceramics, most plastics and rubbers.
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KB 1085-1
Read moreKohesi Bond KB 1085-1 is a two component, graphite filled epoxy system suitable for bonding, sealing and coating. It has a favorable 100:15 (Part A: Part B) mix ratio by weight. Firstly, it offers very good electrical conductivity and a outstanding dimensional stability.
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KB 1151 S-1
Read moreKB 1151 S-1 is a two component, room temperature curing epoxy system suitable for bonding sealing and coating applications. It offers outstanding chemical resistance, particularly to fuels, solvents and alcohols.
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KB 1372 LP
Read moreKohesi Bond KB 1372 LP is a two component, heat curing epoxy system suitable for bonding, sealing, coating and encapsulation. It has a favorable 100:25 (Part A: Part B) mix ratio by weight. This unique epoxy system offers remarkable adhesion to a variety of substrates, such as metals, composites, glass, ceramics, most plastics and rubbers.
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KB 1372-AO
Read moreKohesi Bond KB 1372-AO is a two component, heat curing epoxy system suitable for bonding, sealing, and coating. It has a convenient 10:1 (Part A: Part B) mix ratio by weight. This unique epoxy system offers remarkable\y high glass transition temperature (Tg) of > 172°C.
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KB 1372-LO
Read moreKohesi Bond KB 1372-LO is a two component, room heat curing epoxy system suitable for bonding, sealing, and coating. It has a convenient 10:1 (Part A: Part B) mix ratio by weight. This unique epoxy system offers remarkable\y high glass transition temperature (Tg) of > 172°C. It rapidly cures at moderately elevated temperatures and can achieve even faster cures at higher temperatures.
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KB 1452 HT-2
Read moreKB 1452 HT-2 is a two part system suitable for bonding, sealing, coating, potting and encapsulation applications. Its unique capability of passing USP Class VI testing makes it ideal for use in the medical industry. It can withstand repeated cycles of medical sterilization.
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KB 1452 HT-2AO
Read moreKohesi Bond KB 1452 HT-2AO is an exclusive two component epoxy system suitable for bonding, sealing, coating, potting and encapsulation applications. It has a favorable 100:40 (Part A: Part B) mix ratio by weight. Remarkably, it offers excellent thermal conductivity and an extremely low coefficient of thermal expansion (CTE). The optimal cure schedule is an overnight room temperature set-up followed by a heat cure at 70°C – 90°C for 3 – 5 hours.
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KB 1458 TC
Read moreKohesi Bond KB 1458 TC is a one-of-a-kind, two component, thermal management epoxy system. Firstly, this product offers phenomenal heat transfer capabilities. This products has very low thermal resistance and can be applied in layers as thin as 10 microns.
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KB 1600 FR-V
Read moreKohesi Bond KB 1600 FR-V is a two component epoxy system that offers a convenient to use mix ratio of 1:1 by weight. This flame retardant epoxy is capable of passing the vertical burn test specifications as per Amendment 25-116 and Part 25 Appendix F of the FAR standards.
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KB 1631 ANHT
Read moreKohesi Bond KB 1631 ANHT is a two component, room temperature epoxy system suitable for bonding, sealing and coating. It has a very convenient 1:1 (Part A: Part B) mix ratio by weight or volume. Primarily, it offers stellar thermal conductivity, making it ideal for heat transfer applications. This epoxy system readily cures at room temperature and can achieve faster cures at elevated temperatures.
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KB 1631 AOLV-1
Read moreKohesi Bond KB 1631 AOLV-1 is a two component epoxy system suitable for bonding, sealing, coating, potting and encapsulation applications. It offers a favorable one to one mix ratio by weight or volume. In addition, it has a long open time, a low exotherm and good flow properties when mixed, making it ideal for potting and encapsulating. This epoxy system readily cures at room temperature and can achieve faster cures at elevated temperatures.
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KB 1631 FR-2
Read moreKB 1631 FR-2 is an easy to use two component system, suitable for potting, encapsulation and casting applications. This product’s noteworthy features are its capability of passing UL 94 V-0 testing, its low smoke generation and that it contains a non-halogenated filler.
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KB 1631 HTC-1
Read moreKB 1631 HTC-1 is a high performance two part epoxy suitable for bonding and sealing applications. This products offers stellar thermal conductivity of 1.5 – 1.6 W/m/K, it is cryogenically serviceable and it is capable of passing NASA standards for low outgassing (ASTM E-595).
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KB 1686 M
Read moreKohesi Bond KB 1686 M is a two component, nickel filled epoxy system suitable for bonding, coating and sealing. It has a convenient 1:1 (Part A: Part B) mix ratio by weight or volume. Firstly, it offers very good electrical conductivity and dimensional stability.
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KB 1689
Read moreKohesi Bond KB 1689 is a two component, toughened, silver coated nickel filled epoxy system suitable for bonding and sealing. It has a convenient 1:1 (Part A: Part B) mix ratio by weight. Firstly, it offers very good electrical conductivity and very low shrinkage upon cure.
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TUF 1452 HT-2
Read moreKohesi Bond TUF 1452 HT-2 is a two component, room temperature curing epoxy system suitable for bonding, sealing, potting and encapsulation. It has a favorable 100:40 (Part A: Part B) mix ratio by weight or 100:50 (Part A: Part B) mix ratio by volume. This unique epoxy system offers remarkable adhesion to wide variety of substrates including metals, ceramics, most plastics and glass.
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TUF 1621 AOHT
Read moreKohesi Bond TUF 1621 AOHT is a two component, room temperature curing epoxy system suitable for bonding and sealing. It is capable of passing NASA standards for low outgassing (ASTM E-595) and has a convenient 1:1 (Part A: Part B) mix ratio by weight or volume. This unique epoxy system offers remarkable toughness and superior peel strength.
One Component Epoxy Products
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TUF 1828 TC
Read moreKohesi Bond TUF 1828 TC is a toughened, single component, thermal management epoxy system that offers an unlimited working life at room temperature.
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TUF 1820 ANHT
Read moreKohesi Bond TUF 1820 ANHT is a toughened, single component epoxy system that offers phenomenal thermal conductivity while maintaining its superior electrical insulation properties. It requires no mixing and offers an unlimited working life at room temperature.
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TUF 1613 HT-SM
Read moreKohesi Bond TUF 1613 HT-SM is a true single component system that requires no mixing and cures hard at elevated temperatures. Although it requires a minimum temperature of 120°C for curing (at which it cures extraordinarily fast), it can achieve even faster cures at higher temperatures.
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TUF 1613 HT-GT
Read moreKohesi Bond TUF 1613 HT-GT is a single component, toughened epoxy system that requires no mixing and cures rapidly at elevated temperatures. Although it requires a minimum temperature of 120°C for curing (at which it cures extraordinarily fast), it can achieve even faster cures at elevated temperatures.
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TUF 1613 HT-CM
Read moreKohesi Bond TUF 1613 HT-CM is a toughened, single component system that requires no mixing and cures readily at elevated temperatures. Although it requires a minimum temperature of 120°C for curing (at which it cures extraordinarily fast), it can achieve even faster cures at higher temperatures.
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KB 1613 RLV
Read moreKohesi Bond KB 1613 RLV is a true single component system that requires no mixing and cures hard at elevated temperatures. Although it requires a minimum temperature of 120°C for curing (at which it cures extraordinarily fast), it can achieve even faster cures at elevated temperatures.
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KB 1613 R80
Read moreKohesi Bond KB 1613 R80 is a single component epoxy system suitable for bonding, sealing, potting and encapsulation applications. Being a one component system, it does not require any mixing and offers an unlimited working life at room temperature.
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KB 1427 HT-3
Read moreThis product’s unlikely low exotherm makes it ideal for use in potting up to 1/4 inch thicknesses. Being a one component system, it requires no mixing and provides ease of application. This epoxy system will not set-up unless heated above 100°C.
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TUF 1820 HTS
Read moreTUF 1820HTS is a silver filled, single component, heat curing epoxy system. It offers excellent electrical conductivity (volume resistivity of < 0.005 ohm-cm). Also, this product is cryogenically serviceable.
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TUF 1613 HT-DA
Read moreTUF 1613 HT-DA is a true one part system that is specially formulated for die attach applications. It has an ideal dispensing profile with no tailing. In addition to superior electrical insulation, it also offers phenomenal thermal conductivity of 1.4 – 1.5 W/m/K.
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KB 1427 HT
Read moreKB 1427 HT is a path-breaking one part epoxy used for bonding, sealing, coating and casting applications. It offers a roaring glass transition temperature Tg of 220°C – 230°C and stellar chemical resistance to a wide variety of fuels, oil and water.
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TUF 1820 AOHT
Read moreTUF 1820 AOHT is a toughened single component system that offers very good thermal conductivity and it is cryogenically serviceable. Owing to its stunning mechanical strength properties (tensile lap shear strength of > 3,800 psi), it is commonly used for bonding and sealing applications.
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KB 1613 HT
Read moreKB 1613 HT is a one component heat curing epoxy system, that is typically used for bonding, sealing and coating applications. It offers rapid cures at elevated temperatures (5 – 10 minutes at 150°C) as well as outstanding physical strength properties.