KB 1151 S-1

Kohesi Bond KB 1151 S-1 is a two component, room temperature curing epoxy system suitable for bonding, sealing, coating, potting and encapsulation. It has a favorable 100:30 (Part A: Part B) mix ratio by weight. This unique epoxy system offers remarkable adhesion to a variety of substrates, such as metals, composites, glass, ceramics, most plastics and rubbers. It readily cures at room temperature and can achieve faster cures at elevated temperatures. The optimal cure schedule is an overnight room temperature set-up followed by a heat cure at 70°C – 90°C for 3 – 5 hours. KB 1151 S-1 is uniquely formulated for protection against harsh chemicals, especially fuels and solvents. Additionally, it contains no solvents or diluents, making it a 100% reactive system. It offers an extensive serviceable temperature range of -50°C to +150°C. This superior adhesive fosters outstanding physical strength properties. It offers very low shrinkage upon cure and excellent flow properties. In addition, it has superior electrical insulation properties. Part A is clear, whereas Part B is amber clear in clear. This product can be formulated in a non-drip viscosity as well. KB 1151 S-1 is widely used in electronic, aerospace, chemical processing and specialty OEM applications where resistance to solvents and fuels is critical.