Adhesives, Sealants and Coatings for a Variety of Industries
Kohesi Bond’s extensive line of cutting-edge adhesives, sealants, coatings, potting and encapsulation compounds are used in numerous other industries. Our high-performance products come with an array of mechanical, optical, electrical, chemical, thermal and curing properties. Kohesi Bond specializes in tailoring products to precisely meet your end requirements. Our products are available in various packaging options, to offer ease of use and improve efficiency. For detailed information and inquiries, please don’t hesitate to contact us. We are eager to assist you promptly and address any questions you may have.
Adhesive Usage in the Other Industries
Kohesi Bond specializes in formulating innovative adhesives, sealants, coatings, potting and encapsulation compounds for the automotive industry. Our advanced one and two component epoxy systems for the automotive industry are highly resistant to impact, shock, vibrations, extreme temperatures, variety of chemicals, and abrasions. In addition, they offer superior bond strength and adhere extremely well to similar and dissimilar substrates.
Kohesi Bond’s automotive industry adhesives are used in a variety of automotive applications, such as automotive interiors, exteriors, structural bonding, chassis and powertrain, automotive lighting and electronics, fuel tank and injection systems and acoustic management. We offer our adhesives in easy to use packaging that are compatible with automated dispensing machines.
Popular Products
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KB 1031 ATHT-LO
Read moreKohesi Bond KB 1031 ATHT-LO is a two component, highly toughened epoxy system suitable for bonding, sealing and coating applications. It has a convenient 1:1 (Part A: Part B) mix ratio by weight. Remarkably, it offers excellent peel strength and is capable of passing NASA low outgassing test.
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TUF 1621 AOHT
Read moreKohesi Bond TUF 1621 AOHT is a two component, room temperature curing epoxy system suitable for bonding and sealing. It is capable of passing NASA standards for low outgassing (ASTM E-595) and has a convenient 1:1 (Part A: Part B) mix ratio by weight or volume. This unique epoxy system offers remarkable toughness and superior peel strength.
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TUF 1820 AOHT
Read moreTUF 1820 AOHT is a toughened single component system that offers very good thermal conductivity and it is cryogenically serviceable. Owing to its stunning mechanical strength properties (tensile lap shear strength of > 3,800 psi), it is commonly used for bonding and sealing applications.
Kohesi Bond offers a variety of epoxy based, food safe products that are commonly used in the food industry. They can withstand various chemicals, oils, boiling water, freezing temperatures and resist abrasion. The U.S. Food and Drug Administration (FDA) has established two standards for adhesives that are intended for use in producing, manufacturing, packaging, processing, transporting or holding food. These two standards are specified as follows: FDA CFR 175.105 test standard specifies the list of chemicals that are safe to be used in the formulation of epoxy adhesives, sealants and coatings. Products containing these chemicals comply with the FDA CFR 175.105 test standard and are typically used for incidental or accidental food processing and contact. FDA CFR 175.300 is a more stringent and a precise standard established by the U.S. FDA. Our adhesives, sealants and coatings are capable of passing this rigorous test and can be used for a more continued contact with food articles.
Popular Products
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KB 1040 P
Read moreKohesi Bond KB 1040 P is a two component, room temperature curing epoxy system suitable for bonding, sealing, potting and encapsulation. It has a favorable 4:1 (Part A: Part B) mix ratio by weight. This unique epoxy system offers remarkable adhesion to plastics like polycarbonates and acrylics among others without any stress cracking.
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KB 1452 HT-2
Read moreKB 1452 HT-2 is a two part system suitable for bonding, sealing, coating, potting and encapsulation applications. Its unique capability of passing USP Class VI testing makes it ideal for use in the medical industry. It can withstand repeated cycles of medical sterilization.
The need for alternative and renewable sources of energy is growing rampantly. Kohesi Bond offers cutting edge solutions for alternate sources , such as solar, wind, hydropower and fuel cells. Our future ready adhesives, sealants, coatings, potting and encapsulation compounds offer first-rate performance in harsh environments. They can withstand extreme temperatures, pressures, chemicals, abrasion and mechanical stresses. Our one and two component epoxy systems offer a variety of curing options, electrical conductivity, thermal conductivity and high purity. Our high quality products are packaged for ease of use and application. They can be customized to meet your specific requirements.
Popular Products
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KB 10473 FL
Read moreKohesi Bond KB 10473 FL is a two component, room temperature curing epoxy system suitable for bonding, sealing, potting and encapsulation. It has a convenient 1:1 (Part A: Part B) mix ratio by weight. This unique epoxy system offers remarkable flexibility and peel strength. It readily cures at room temperature and can achieve faster cures at elevated temperatures.
-
TUF 1621 AOHT
Read moreKohesi Bond TUF 1621 AOHT is a two component, room temperature curing epoxy system suitable for bonding and sealing. It is capable of passing NASA standards for low outgassing (ASTM E-595) and has a convenient 1:1 (Part A: Part B) mix ratio by weight or volume. This unique epoxy system offers remarkable toughness and superior peel strength.
-
TUF 1820 HTS
Read moreTUF 1820HTS is a silver filled, single component, heat curing epoxy system. It offers excellent electrical conductivity (volume resistivity of < 0.005 ohm-cm). Also, this product is cryogenically serviceable.
Kohesi Bond’s cutting edge research and development team is at the forefront of using the latest nanotechnological developments to advance our adhesives, sealants and coatings. Nanoparticle sized fillers such as ceramic powders, nanoclays, zeolites are used to provide improved performance properties and application in thinner sections. They offer better electrical stability, lower thermal resistance and improved mechanical strength. Our nanoparticle-filled adhesives and coatings are used in semiconductor packaging, microelectronics, optical, optoelectronic and sensor applications. We can customize our products with different nano-fillers to meet your specific requirements.
Popular Products
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KB 1458 TC
Read moreKohesi Bond KB 1458 TC is a one-of-a-kind, two component, thermal management epoxy system. Firstly, this product offers phenomenal heat transfer capabilities. This products has very low thermal resistance and can be applied in layers as thin as 10 microns.
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TUF 1828 TC
Read moreKohesi Bond TUF 1828 TC is a toughened, single component, thermal management epoxy system that offers an unlimited working life at room temperature.
Kohesi Bond’s extensive line of cutting-edge adhesives, sealants, coatings, potting and encapsulation compounds are used in numerous other industries. Our high-performance products come with an array of mechanical, optical, electrical, chemical, thermal and curing properties.
Kohesi Bond specializes in tailoring products to precisely meet your end requirements. Our products are available in various packaging options, to offer ease of use and improve efficiency. For detailed information and inquiries, please don’t hesitate to contact us. We are eager to assist you promptly and address any questions you may have.
Kohesi Bond specializes in formulating innovative adhesives, sealants, coatings, potting and encapsulation compounds for the automotive industry. Our advanced one and two component epoxy systems for the automotive industry are highly resistant to impact, shock, vibrations, extreme temperatures, variety of chemicals, and abrasions. In addition, they offer superior bond strength and adhere extremely well to similar and dissimilar substrates.
Kohesi Bond’s automotive industry adhesives are used in a variety of automotive applications, such as automotive interiors, exteriors, structural bonding, chassis and powertrain, automotive lighting and electronics, fuel tank and injection systems and acoustic management. We offer our adhesives in easy to use packaging that are compatible with automated dispensing machines.
-
KB 1031 ATHT-LO
Read moreKohesi Bond KB 1031 ATHT-LO is a two component, highly toughened epoxy system suitable for bonding, sealing and coating applications. It has a convenient 1:1 (Part A: Part B) mix ratio by weight. Remarkably, it offers excellent peel strength and is capable of passing NASA low outgassing test.
-
TUF 1621 AOHT
Read moreKohesi Bond TUF 1621 AOHT is a two component, room temperature curing epoxy system suitable for bonding and sealing. It is capable of passing NASA standards for low outgassing (ASTM E-595) and has a convenient 1:1 (Part A: Part B) mix ratio by weight or volume. This unique epoxy system offers remarkable toughness and superior peel strength.
-
TUF 1820 AOHT
Read moreTUF 1820 AOHT is a toughened single component system that offers very good thermal conductivity and it is cryogenically serviceable. Owing to its stunning mechanical strength properties (tensile lap shear strength of > 3,800 psi), it is commonly used for bonding and sealing applications.
Kohesi Bond offers a variety of epoxy based, food safe products that are commonly used in the food industry. They can withstand various chemicals, oils, boiling water, freezing temperatures and resist abrasion. The U.S. Food and Drug Administration (FDA) has established two standards for adhesives that are intended for use in producing, manufacturing, packaging, processing, transporting or holding food. These two standards are specified as follows:
FDA CFR 175.105 test standard specifies the list of chemicals that are safe to be used in the formulation of epoxy adhesives, sealants and coatings. Products containing these chemicals comply with the FDA CFR 175.105 test standard and are typically used for incidental or accidental food processing and contact.
FDA CFR 175.300 is a more stringent and a precise standard established by the U.S. FDA. Our adhesives, sealants and coatings are capable of passing this rigorous test and can be used for a more continued contact with food articles.
-
KB 1040 P
Read moreKohesi Bond KB 1040 P is a two component, room temperature curing epoxy system suitable for bonding, sealing, potting and encapsulation. It has a favorable 4:1 (Part A: Part B) mix ratio by weight. This unique epoxy system offers remarkable adhesion to plastics like polycarbonates and acrylics among others without any stress cracking.
-
KB 1452 HT-2
Read moreKB 1452 HT-2 is a two part system suitable for bonding, sealing, coating, potting and encapsulation applications. Its unique capability of passing USP Class VI testing makes it ideal for use in the medical industry. It can withstand repeated cycles of medical sterilization.
-
KB 10473 FL
Read moreKohesi Bond KB 10473 FL is a two component, room temperature curing epoxy system suitable for bonding, sealing, potting and encapsulation. It has a convenient 1:1 (Part A: Part B) mix ratio by weight. This unique epoxy system offers remarkable flexibility and peel strength. It readily cures at room temperature and can achieve faster cures at elevated temperatures.
-
TUF 1621 AOHT
Read moreKohesi Bond TUF 1621 AOHT is a two component, room temperature curing epoxy system suitable for bonding and sealing. It is capable of passing NASA standards for low outgassing (ASTM E-595) and has a convenient 1:1 (Part A: Part B) mix ratio by weight or volume. This unique epoxy system offers remarkable toughness and superior peel strength.
-
TUF 1820 HTS
Read moreTUF 1820HTS is a silver filled, single component, heat curing epoxy system. It offers excellent electrical conductivity (volume resistivity of < 0.005 ohm-cm). Also, this product is cryogenically serviceable.
Kohesi Bond’s cutting edge research and development team is at the forefront of using the latest nanotechnological developments to advance our adhesives, sealants and coatings. Nanoparticle sized fillers such as ceramic powders, nanoclays, zeolites are used to provide improved performance properties and application in thinner sections. They offer better electrical stability, lower thermal resistance and improved mechanical strength. Our nanoparticle-filled adhesives and coatings are used in semiconductor packaging, microelectronics, optical, optoelectronic and sensor applications. We can customize our products with different nano-fillers to meet your specific requirements.
-
KB 1458 TC
Read moreKohesi Bond KB 1458 TC is a one-of-a-kind, two component, thermal management epoxy system. Firstly, this product offers phenomenal heat transfer capabilities. This products has very low thermal resistance and can be applied in layers as thin as 10 microns.
-
TUF 1828 TC
Read moreKohesi Bond TUF 1828 TC is a toughened, single component, thermal management epoxy system that offers an unlimited working life at room temperature.