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KB 1031 SPLV-6
Kohesi Bond KB 1031 SPLV-6 is a two component epoxy system for bonding, sealing, coating and encapsulating. It has a convenient 1:1 (Part A: Part B) mix ratio by weight or volume. This high performance specialty product offers a unique combination of low viscosity, low exotherm and very long working life.
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KB 1039 CRLP
Kohesi Bond KB 1039 CRLP is a two component, heat curing epoxy system suitable for bonding, sealing, coating, potting and encapsulation. It has a favorable 100:65 (Part A: Part B) mix ratio by weight. This unique epoxy system offers remarkable adhesion to a variety of substrates, such as metals, composites, glass, ceramics, most plastics and rubbers.
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KB 1040
Kohesi Bond KB 1040 is a two component, room temperature curing epoxy system suitable for bonding, sealing, potting and encapsulation. It has a favorable 4:1 (Part A: Part B) mix ratio by weight. This unique epoxy system offers remarkable adhesion to a variety of substrates, such as metals, glass, ceramics, most plastics and rubbers.
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KB 10473 FL
Kohesi Bond KB 10473 FL is a two component, room temperature curing epoxy system suitable for bonding, sealing, potting and encapsulation. It has a convenient 1:1 (Part A: Part B) mix ratio by weight. This unique epoxy system offers remarkable flexibility and peel strength. It readily cures at room temperature and can achieve faster cures at elevated temperatures.
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KB 1631 HTC-1
KB 1631 HTC-1 is a high performance two part epoxy suitable for bonding and sealing applications. This products offers stellar thermal conductivity of 1.5 – 1.6 W/m/K, it is cryogenically serviceable and it is capable of passing NASA standards for low outgassing (ASTM E-595).
Kohesi Bond’s performance products are the industry standard for optical applications. Our products offer first-rate optical clarity, match refractive indices with commonly used substrates and superior non-yellowing properties. In addition they provide various electrical, thermal and chemical resistance properties. They are available in varying viscosities and adhere well to a wide range of substrates, such as glass, quartz, metal, various plastics and optical fibers. In addition, they are capable of passing NASA standards for low outgassing (ASTM E-595). Our unique one and two component epoxy adhesives are can be customized to meet specific requirements of the optical industry.
Kohesi Bond’s extensive range of one and two component epoxy adhesives, sealants, coatings, potting and encapsulation compounds have been formulated for specific use in fiber optic applications. Optical fibers are flexible fibers made of glass or other transparent material that transmit light signals from one end to the other end of the fiber. Typical applications include bonding, sealing and potting fibers into ferrules and connectors, potting splices, v-groove arrays and field repairs. Our adhesives offer phenomenal bond strength, dimensional stability, optical clarity and can withstand extreme temperatures and harsh environments. They can be customized to meet your specific requirements.
Kohesi Bond offers a complete range of products that meet all the requirements of the LED industry. Our adhesives, sealants, coatings, potting and encapsulation compounds are used at every stage of LED manufacturing process. Typical applications include die attach, thermal management, conformal coating, lens bonding and sealing and optical encapsulation. Our products are capable of withstanding extremely high and low temperatures, harsh moisture and humidity conditions, provide non-yellowing properties, resist abrasion and offer stress free bonds. They adhere well to a wide range of similar and dissimilar substrates. In addition they cover a wide range of refractive indices and offer first-rate optical clarity. Specific thermally conductive grades help dissipating heat effectively, keeping the LED circuits cool. Also, our products are capable of passing NASA standards for low outgassing (ASTM E-595).
With the growing use of laser devices, Kohesi Bond has formulated specialty systems suitable for use in such devices. Laser is an acronym for “Light Amplification by Stimulated Emission of Radiation“. Lasers are vastly used in many applications like optical disk drives, 3D laser printers, barcode scanners, accelerometers, communication devices, medical devices, spectroscopy, imaging equipments, data storage drives and optical lighting displays. Our optical adhesives, sealants, coatings, potting and encapsulation compounds offer superior adhesion, optical clarity, wide range of refractive indices, thermal management, dimensional stability and low coefficients of thermal expansion. They can withstand extreme temperatures and accurately hold the alignment of various components. We can precisely customize our products to meet your specific requirements.
Kohesi Bond is at the forefront of manufacturing specialty adhesives, sealants, coatings, potting and encapsulation compounds for the electro-optical industry. Our one and two component epoxy systems are commonly used in an array of electro-optical applications, such as imaging devices, inspection and monitoring systems, amplifiers, microscopes, defense equipment, medical devices and military sensors. Our performance systems offer excellent adhesion to similar as well as dissimilar substrates. Commonly used substrates include, glass, quartz, metal, various plastics and ceramics. Our adhesives can withstand extremely high as well as low temperatures, provide efficient gap filling, superior dimensional stability and low coefficients of thermal expansion (CTE). They can withstand harsh chemicals and extreme moisture environments. Our products are capable of passing NASA standards for low outgassing (ASTM E-595), making them ideal for hermetically sealed and high vacuum environments. Specific grades offer very high electrical and/or thermal conductivity. Kohesi Bond specializes in custom formulating products to meet your electro-optical requirements.
Photonics is a special field in modern optics dealing with emission, transmission, modulation, amplification and detection of light over a wide spectrum. Kohesi Bond offers first-rate adhesives, sealants, coatings, potting and encapsulation compounds that have been formulated especially for the photonics industry. Our extensive product range offers superior optical clarity and transmission over a wide range of wavelengths. This typically ranges from near UV through infrared regions. They offer a range of refractive indices. In addition, our products are capable of withstanding extreme temperatures, superior abrasion and wear resistance and resistance to long hours of 85°°C / 85% relative humidity testing. Also, they are capable of passing NASA standards for low outgassing. We can custom formulate our products to meet your specific requirements.
Kohesi Bond manufactures specialty one and two component epoxy systems, ideal for use in display devices. They are commonly employed in LCD / LED / plasma / OLED monitors, navigation screens, tablets, laptops, mobile phones and gaming devices. Our adhesives, sealants, coatings, potting and encapsulation compounds offer low stress adhesion to various substrates including glass, plastics, metals and various ceramics. They offer dimensional stability, optical clarity, superior non-yellowing, high bond strength and flexibility. Our products come in a wide range of viscosities and curing properties. They are capable of withstanding multiple thermal cycles, impact, shock and vibrations. In addition, specific grades are capable of passing NASA standards for low outgassing (ASTM (E-595). We specialize in tailor-fitting our products to your specific requirements.
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