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adhesives for electronic industry

Adhesives for the Assembly of Electronic Devices

Kohesi Bond is at the forefront of manufacturing one and two component epoxy and sodium silicate based systems, primarily formulated for the electronics and the electrical industries. These specially designed industrial electronics adhesives, sealants, coatings, potting and encapsulation compounds meet the highest quality standards. Also, they are capable of passing various industrial certifications such as NASA standards for low outgassing (ASTM E-595) and UL 94 V-0 for flame retardancy. Our superior products offer superior electrical and thermal properties. Specific grades offer first-rate electrical conductivity for shielding, wire bonding and grounding applications. They adhere well to similar and dissimilar substrates and provide excellent dimensional stability. Our vast range of adhesives for electronic components can withstand extremely high and low temperatures, harsh chemical environments and offer low coefficient of thermal expansion (CTE). We can tailor our products to match specific curing and flow properties. In addition, our easy to use packaging allows for minimal waste and can be readily used with automated dispensing machines.

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Adhesive Usage in the Electronic Devices

Conformal coatings are a thin polymer coating that conforms to the topography of the PCB. Kohesi Bond offers specially formulated, superior quality conformal coatings. They protect the circuit from dust, moisture, chemicals, stress, dirt, abrasion, shock and vibrations. Our conformal coatings offer excellent flow properties, wide temperature serviceability, fast cures, first-rate dielectric strength and low stress. Their low viscosities help them flow through tight gaps and intricate shapes, covering the entire area. Our products are 100% solids, i.e. they do not contain any solvents. We can tailor-make each product to meet your specific requirements.

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Die attach is the process of bonding a die or a chip to a microelectronic semiconductor package or another die substrate. Kohesi Bond specializes in formulating die attach adhesives that offer superior bond strength to the die pad. These dimensionally stable systems are available as one and two component systems. They provide the right viscosity for dispensing various patterns onto the die without any tailing. Additionally, we offer thermally conductive as well as electrically conductive die attach adhesives that contain low ionic impurities. They offer excellent resistance to thermal as well as mechanical shock and cycling. We can customize our products to meet your specific requirements.

Popular Products

Glob tops are semiconductor encapsulations to protect the sensitive dies and wire bonds, typically used in chip on board (COB) applications. Kohesi Bond’s distinctive glob top epoxy systems offer protection against moisture, dust, mechanical stress, chemicals and other contaminants.  Glob top compounds can be directly applied on the chip or can be applied using the dam-and-fill mechanism. They provide excellent low stress bonding to similar as well as dissimilar substrates and are capable of withstanding extreme thermal cycling/shocks. Our glob top adhesives offer superior electrical insulation and specific grades offer outstanding thermal conductivity. Kohesi Bond can formulate the products to your specifications.  If you are looking for a reliable glob top encapsulation solution, our team at Kohesi Bond can help you formulate the products to your specifications.

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Surface mount adhesives (SMA) are used to attach electronic components directly onto the printed circuit board (PCB). Kohesi Bond manufactures superior surface mount adhesives that are ideal for replacing solder joining. Our adhesives offer excellent electrical conductivity that provide admirable green strength, holding parts in place during the cure process. In addition, they can withstand thermal stresses, contain low ionic impurities and dispense without tailing. They can cure swiftly at solder reflow temperatures and offer low stress bonds. These adhesives are commonly employed in various chip on board assemblies and opto-electronic circuits. Specific grades provide electrical insulation and excellent thermal conductivity. We can tailor each product to your specifications.

Popular Products

Kohesi Bond offers innovative underfill encapsulants for flip-chip, chip scale packaging (CSP) and ball grid array (BGA) devices. Our underfill epoxies offer capillary flow action, low stress adhesion between dissimilar substrates and excellent protection against moisture and other contaminants. They provide low coefficients of thermal expansion (CTE), very high purity (low ionic content) and excellent resistance to thermal/mechanical cycling/shock. Also, they help redistributing the stresses away from the solder joints, making them ideal for underfill applications. We can customize our products to meet your specific requirements.

Popular Products

Kohesi Bond’s quality adhesives, sealants and coatings offer first-rate shielding against electromagnetic and radio frequency interference. Superior shielding is essential in electronic applications, such as navigation, communication, radar, power and monolithic microwave integrated circuits (MMICs).Our electrically conductive products are filled with either silver or silver coated nickel or nickel or graphite powders, offering varying range of electrical conductivity. They provide effective shielding and grounding across a wide range of frequencies. Kohsei Bond can custom formulate one and two component epoxies and sodium silicate based systems for superior performance in your applications.

Popular Products

Kohesi Bond is a pioneer in formulating and manufacturing adhesives, sealants, coatings, potting and encapsulation compounds for the electronics and the electrical industry.  Our products range from conformal coatings to die attaches to underfills. We provide a complete solution for semiconductor and PCB manufacturing and packaging applications. Some of them include, DRAM, flash storage, CSP, BGA, CFN, passive and discrete components, optics and SOIC. Our products offer wide serviceable temperature range, thermal conductivity, electrical conductivity, optical clarity, electrical insulation, low coefficient of thermal expansion (CTE), high purity (low ionic content), low stress and they are manufactured with the highest quality. We specialize in custom formulating products to help engineers meet their specific requirements.

Popular Products

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Kohesi Bond is at the forefront of manufacturing one and two component epoxy and sodium silicate based systems, primarily formulated for the electronics and the electrical industries. These specially designed industrial electronics adhesives, sealants, coatings, potting and encapsulation compounds meet the highest quality standards. Also, they are capable of passing various industrial certifications such as NASA standards for low outgassing (ASTM E-595) and UL 94 V-0 for flame retardancy. Our superior products offer superior electrical and thermal properties. Specific grades offer first-rate electrical conductivity for shielding, wire bonding and grounding applications. They adhere well to similar and dissimilar substrates and provide excellent dimensional stability. Our vast range of adhesives for electronic components can withstand extremely high and low temperatures, harsh chemical environments and offer low coefficient of thermal expansion (CTE). We can tailor our products to match specific curing and flow properties. In addition, our easy to use packaging allows for minimal waste and can be readily used with automated dispensing machines.

discuss your application
Conformal coatings are a thin polymer coating that conforms to the topography of the PCB. Kohesi Bond offers specially formulated, superior quality conformal coatings. They protect the circuit from dust, moisture, chemicals, stress, dirt, abrasion, shock and vibrations. Our conformal coatings offer excellent flow properties, wide temperature serviceability, fast cures, first-rate dielectric strength and low stress. Their low viscosities help them flow through tight gaps and intricate shapes, covering the entire area. Our products are 100% solids, i.e. they do not contain any solvents. We can tailor-make each product to meet your specific requirements.
Popular Products

Die attach is the process of bonding a die or a chip to a microelectronic semiconductor package or another die substrate. Kohesi Bond specializes in formulating die attach adhesives that offer superior bond strength to the die pad. These dimensionally stable systems are available as one and two component systems. They provide the right viscosity for dispensing various patterns onto the die without any tailing. Additionally, we offer thermally conductive as well as electrically conductive die attach adhesives that contain low ionic impurities. They offer excellent resistance to thermal as well as mechanical shock and cycling. We can customize our products to meet your specific requirements.
Popular Products

Glob tops are semiconductor encapsulations to protect the sensitive dies and wire bonds, typically used in chip on board (COB) applications. Kohesi Bond’s distinctive glob top epoxy systems offer protection against moisture, dust, mechanical stress, chemicals and other contaminants.  Glob top compounds can be directly applied on the chip or can be applied using the dam-and-fill mechanism. They provide excellent low stress bonding to similar as well as dissimilar substrates and are capable of withstanding extreme thermal cycling/shocks. Our glob top adhesives offer superior electrical insulation and specific grades offer outstanding thermal conductivity. Kohesi Bond can formulate the products to your specifications.  If you are looking for a reliable glob top encapsulation solution, our team at Kohesi Bond can help you formulate the products to your specifications.

Surface mount adhesives (SMA) are used to attach electronic components directly onto the printed circuit board (PCB). Kohesi Bond manufactures superior surface mount adhesives that are ideal for replacing solder joining. Our adhesives offer excellent electrical conductivity that provide admirable green strength, holding parts in place during the cure process. In addition, they can withstand thermal stresses, contain low ionic impurities and dispense without tailing. They can cure swiftly at solder reflow temperatures and offer low stress bonds. These adhesives are commonly employed in various chip on board assemblies and opto-electronic circuits. Specific grades provide electrical insulation and excellent thermal conductivity. We can tailor each product to your specifications.
Popular Products

Kohesi Bond offers innovative underfill encapsulants for flip-chip, chip scale packaging (CSP) and ball grid array (BGA) devices. Our underfill epoxies offer capillary flow action, low stress adhesion between dissimilar substrates and excellent protection against moisture and other contaminants. They provide low coefficients of thermal expansion (CTE), very high purity (low ionic content) and excellent resistance to thermal/mechanical cycling/shock. Also, they help redistributing the stresses away from the solder joints, making them ideal for underfill applications. We can customize our products to meet your specific requirements.
Popular Products

Kohesi Bond’s quality adhesives, sealants and coatings offer first-rate shielding against electromagnetic and radio frequency interference. Superior shielding is essential in electronic applications, such as navigation, communication, radar, power and monolithic microwave integrated circuits (MMICs).Our electrically conductive products are filled with either silver or silver coated nickel or nickel or graphite powders, offering varying range of electrical conductivity.

They provide effective shielding and grounding across a wide range of frequencies. Kohsei Bond can custom formulate one and two component epoxies and sodium silicate based systems for superior performance in your applications.

Popular Products

Kohesi Bond is a pioneer in formulating and manufacturing adhesives, sealants, coatings, potting and encapsulation compounds for the electronics and the electrical industry. 

Our products range from conformal coatings to die attaches to underfills. We provide a complete solution for semiconductor and PCB manufacturing and packaging applications. Some of them include, DRAM, flash storage, CSP, BGA, CFN, passive and discrete components, optics and SOIC. Our products offer wide serviceable temperature range, thermal conductivity, electrical conductivity, optical clarity, electrical insulation, low coefficient of thermal expansion (CTE), high purity (low ionic content), low stress and they are manufactured with the highest quality. We specialize in custom formulating products to help engineers meet their specific requirements.

Popular Products