Adhesive Systems for the Aerospace Industry
Kohesi Bond is a pioneer in manufacturing first-rate adhesives, sealants, coatings, potting and encapsulation compounds, designed specifically for use in the aerospace industries. We offer an extensive range of polyimide, one as well as two component epoxies and sodium silicate based systems that meet the stringent requirements of this industry. Specific grades are capable of passing NASA standards for low outgassing (ASTM E-595), UL94V-0 and FAR 25.853 (a) flame retardancy tests. These aerospace adhesives systems are commonly employed in the manufacture of airplanes, helicopters, rotorcrafts, satellites and unmanned aerial vehicles (UAVs). Our unique products offer the desired structural strength, chemical resistance, high as well as low temperature resistance and extremely low flame, smoke and toxic emissions (FST). Kohesi Bond specializes in customizing our products to meet your exact design specifications to provide improved performance, weight savings, durability and ease of application.
Adhesive Usage in the Aerospace Industry
Popular Products
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KB 1031 AT-S
Read moreKohesi Bond KB 1031 AT-S is a two component, silver filled, electrically conductive epoxy system suitable for bonding and sealing. It has a convenient 1:1 (Part A: Part B) mix ratio by weight. It offers unprecedentedly low volume resistivity (< 10-3 ohm-cm) and remarkably high thermal conductivity.
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KB 1631 FR-2
Read moreKB 1631 FR-2 is an easy to use two component system, suitable for potting, encapsulation and casting applications. This product’s noteworthy features are its capability of passing UL 94 V-0 testing, its low smoke generation and that it contains a non-halogenated filler.
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TUF 1820 AOHT
Read moreTUF 1820 AOHT is a toughened single component system that offers very good thermal conductivity and it is cryogenically serviceable. Owing to its stunning mechanical strength properties (tensile lap shear strength of > 3,800 psi), it is commonly used for bonding and sealing applications.
Popular Products
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KB 1039 CRLP
Read moreKohesi Bond KB 1039 CRLP is a two component, heat curing epoxy system suitable for bonding, sealing, coating, potting and encapsulation. It has a favorable 100:65 (Part A: Part B) mix ratio by weight. This unique epoxy system offers remarkable adhesion to a variety of substrates, such as metals, composites, glass, ceramics, most plastics and rubbers.
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KB 1040 P
Read moreKohesi Bond KB 1040 P is a two component, room temperature curing epoxy system suitable for bonding, sealing, potting and encapsulation. It has a favorable 4:1 (Part A: Part B) mix ratio by weight. This unique epoxy system offers remarkable adhesion to plastics like polycarbonates and acrylics among others without any stress cracking.
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KB 1600 FR-V
Read moreKohesi Bond KB 1600 FR-V is a two component epoxy system that offers a convenient to use mix ratio of 1:1 by weight. This flame retardant epoxy is capable of passing the vertical burn test specifications as per Amendment 25-116 and Part 25 Appendix F of the FAR standards.
Popular Products
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KB 1031 AT-2LO
Read moreKB 1031 AT-2LO can withstand severe thermal shocks and cycling even at cryogenic temperatures. It offers an extensive serviceable temperature range of 4K (-269.15°C) to +120°C. It is a phenomenal adhesive that fosters outstanding physical strength properties and yet consolidates high peel strength and elongation.
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TUF 1621 AOHT
Read moreKohesi Bond TUF 1621 AOHT is a two component, room temperature curing epoxy system suitable for bonding and sealing. It is capable of passing NASA standards for low outgassing (ASTM E-595) and has a convenient 1:1 (Part A: Part B) mix ratio by weight or volume. This unique epoxy system offers remarkable toughness and superior peel strength.
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TUF 1820 ANHT
Read moreKohesi Bond TUF 1820 ANHT is a toughened, single component epoxy system that offers phenomenal thermal conductivity while maintaining its superior electrical insulation properties. It requires no mixing and offers an unlimited working life at room temperature.
Kohesi Bond is a pioneer in manufacturing first-rate adhesives, sealants, coatings, potting and encapsulation compounds, designed specifically for use in the aerospace industries. We offer an extensive range of polyimide, one as well as two component epoxies and sodium silicate based systems that meet the stringent requirements of this industry. Specific grades are capable of passing NASA standards for low outgassing (ASTM E-595), UL94V-0 and FAR 25.853 (a) flame retardancy tests. These aerospace adhesives systems are commonly employed in the manufacture of airplanes, helicopters, rotorcrafts, satellites and unmanned aerial vehicles (UAVs). Our unique products offer the desired structural strength, chemical resistance, high as well as low temperature resistance and extremely low flame, smoke and toxic emissions (FST). Kohesi Bond specializes in customizing our products to meet your exact design specifications to provide improved performance, weight savings, durability and ease of application.
-
KB 1031 AT-S
Read moreKohesi Bond KB 1031 AT-S is a two component, silver filled, electrically conductive epoxy system suitable for bonding and sealing. It has a convenient 1:1 (Part A: Part B) mix ratio by weight. It offers unprecedentedly low volume resistivity (< 10-3 ohm-cm) and remarkably high thermal conductivity.
-
KB 1631 FR-2
Read moreKB 1631 FR-2 is an easy to use two component system, suitable for potting, encapsulation and casting applications. This product’s noteworthy features are its capability of passing UL 94 V-0 testing, its low smoke generation and that it contains a non-halogenated filler.
-
TUF 1820 AOHT
Read moreTUF 1820 AOHT is a toughened single component system that offers very good thermal conductivity and it is cryogenically serviceable. Owing to its stunning mechanical strength properties (tensile lap shear strength of > 3,800 psi), it is commonly used for bonding and sealing applications.
Through cutting edge research and development, Kohesi Bond has formulated adhesives, sealants and coatings, designed primarily for safe use in aircraft interiors. These epoxy based formulations are capable of passing the FAR 25.853 (a) flame retardancy tests. They contain non-halogenated fillers and are tested for exceptionally low flame, smoke and toxicity emissions (FST). Our adhesives are offered in different viscosities and colors. Also, they adhere superbly to a wide variety of similar and dissimilar substrates, such as metals, plastics, ceramics, glass and many rubbers. They provide excellent strength and the desired acoustic properties ideal for use in aircraft cabin interiors. They maintain their aesthetic feel by resisting scratches, stains discoloration. These outstanding aerospace grade epoxy systems are typically employed in overhead stowage compartments, doors, floors and interior panels. Our adhesives can be tailored to meet your exact specifications and are available in easy to use packaging. Kohesi Bond specializes in providing high-quality adhesives in the aerospace industry, ensuring effective and durable bonding for aircraft interiors.
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KB 1039 CRLP
Read moreKohesi Bond KB 1039 CRLP is a two component, heat curing epoxy system suitable for bonding, sealing, coating, potting and encapsulation. It has a favorable 100:65 (Part A: Part B) mix ratio by weight. This unique epoxy system offers remarkable adhesion to a variety of substrates, such as metals, composites, glass, ceramics, most plastics and rubbers.
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KB 1040 P
Read moreKohesi Bond KB 1040 P is a two component, room temperature curing epoxy system suitable for bonding, sealing, potting and encapsulation. It has a favorable 4:1 (Part A: Part B) mix ratio by weight. This unique epoxy system offers remarkable adhesion to plastics like polycarbonates and acrylics among others without any stress cracking.
-
KB 1600 FR-V
Read moreKohesi Bond KB 1600 FR-V is a two component epoxy system that offers a convenient to use mix ratio of 1:1 by weight. This flame retardant epoxy is capable of passing the vertical burn test specifications as per Amendment 25-116 and Part 25 Appendix F of the FAR standards.
Kohesi Bond tailor makes one and two component epoxy based adhesives that offer first-rate mechanical strength properties required for structural aerospace applications. Our structural epoxy adhesives adhere magnificently to similar and dissimilar substrates. Some of these substrates include metals, various plastics, glass, ceramics, composites and many rubbers. They offer excellent toughness and can endure cyclic fatigue stresses. In addition, our aerospace structural adhesives, sealants and coatings are capable of passing NASA standards for low outgassing (ASTM E-595) and UL specifications for flame retardancy. These aircraft structural adhesives can hold up to extreme temperatures, high compressive loads and offer superior peel strength. Our products are available in varying viscosities and can be packaged for ease of use. Kohesi Bond specializes in offering custom solutions to meet your specific requirements.
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KB 1031 AT-2LO
Read moreKB 1031 AT-2LO can withstand severe thermal shocks and cycling even at cryogenic temperatures. It offers an extensive serviceable temperature range of 4K (-269.15°C) to +120°C. It is a phenomenal adhesive that fosters outstanding physical strength properties and yet consolidates high peel strength and elongation.
-
TUF 1621 AOHT
Read moreKohesi Bond TUF 1621 AOHT is a two component, room temperature curing epoxy system suitable for bonding and sealing. It is capable of passing NASA standards for low outgassing (ASTM E-595) and has a convenient 1:1 (Part A: Part B) mix ratio by weight or volume. This unique epoxy system offers remarkable toughness and superior peel strength.
-
TUF 1820 ANHT
Read moreKohesi Bond TUF 1820 ANHT is a toughened, single component epoxy system that offers phenomenal thermal conductivity while maintaining its superior electrical insulation properties. It requires no mixing and offers an unlimited working life at room temperature.
Adhesive systems play a crucial role in the aerospace industry. It serves a wide range of applications such as joining components, sealing gaps, protecting sensitive electronic components, and enhancing surface finishes. The aerospace industry requires high-performance adhesive systems that can withstand extreme temperatures, pressure, and stress. To meet these demands, we at Kohesi Bond are constantly developing and utilizing advanced technologies
Are you in search of cutting-edge adhesive solutions tailored to meet the demands of your aerospace applications? We invite you to get in touch with us to discover more about our wide range of high-performance adhesive systems.