Case Study: Bonding Electronic Components Using Fast Curing Adhesives
The customer wants to bond sensitive electronic components to a printed circuit board (PCB). The adhesion needs to be fast curing, dimensionally stable, withstand high temperatures and resist chemicals. In order to recommend the right solution, our technical expert needs to find out answers to certain questions pertaining to the customers application:
Utsav Shah is a 34-year-old entrepreneur with a passion for scientific discovery. Utsav’s journey began with a deep dive into materials science, earning degrees from USC and the Institute of Chemical Technology. He’s the visionary founder of Kohesi Bond, a top-rated adhesive manufacturer, and Cenerge Engineering Solutions, a leader in heat exchangers and cryogenic pumps. With over a decade of experience, Utsav consults across various industries, ensuring they have the perfect adhesive solution for their needs. Connect with him on LinkedIn!
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