Potting and Encapsulation

Potting and encapsulation compounds are materials used to fill and seal cavities in various electronic and microelectronic components such as sensors, motors, coils, transformers, capacitors, switches, connectors, power supplies and cable harnesses. These liquid or semi-liquid compounds are injected or poured into the electronic components to create a protective barrier against external influences and to provide insulation and stability.

There are a variety of potting and encapsulation compounds including epoxy resins, polyurethane resins, silicone resins among others. Kohesi Bond, in particular, specialises in custom formulated polyimide and epoxy potting and encapsulation compounds as they offer excellent adhesion, thermal resistance and chemical resistance.

Potting and encapsulation compounds are commonly applied to a surface using two primary methods, by manual pouring or using dispensers. 

• Manual application involves pouring the potting compound into the cavity or housing substrate.. The compound flows around and encases the components, filling voids and ensuring complete coverage.
• For more precise and faster production, potting compounds can be applied using syringes, semi automatic gun applicators or automatic meter-mix-dispensing systems.

The cure time for potting and encapsulation compounds can vary depending on several factors, including the specific compound used, ambient temperature, humidity, and the desired level of curing. Cure times can range from a few minutes to several hours or even days.

Depending on the choice of potting compound there are a few methods you can use to remove potting and encapsulation compounds:

• Mechanical Removal: This involves physically scraping, chipping, or cutting away the cured compound from the encapsulated components.
• Chemical Solvents: Certain solvents or chemicals can soften or dissolve potting and encapsulation compounds, making them easier to remove. Care needs to be taken to ensure the compatibility of your components with the chemical solvent.
• Thermal Removal:  Some potting compounds can be softened by subjecting them to high temperatures. Heat can be applied using methods such as heat guns, hot plates, or ovens. However, it is crucial to ensure that the components being encapsulated can withstand the elevated temperatures without being damaged.

Potting and encapsulation compounds can vary in their thermal conductivity properties. Some applications demand compounds with high thermal conductivity while others require compounds with lower thermal conductivity. 

Kohesi Bond, the foremost industrial potting compound producer, offers thermally conductive compounds that provide phenomenal heat dissipation properties. These thermally conductive encapsulation compounds are required in the electronic industry for applications such as potting and encapsulation of sensors and chip-scale packages.

The UL V-0 rating is a classification given to compounds that have been tested and found to resist ignition and self-extinguish when exposed to flames. When you are selecting compounds, you have to verify if the compounds have the UL V-O rating. As one of the top potting compound manufacturers, Kohesi Bond offers special grades that are capable of passing UL94V-0 flame retardancy.

Potting compounds play a vital role in a wide range of industries and applications. They serve multiple purposes, including the creation of a protective barrier around sensitive components, providing effective electrical insulation, enhancing the structural integrity of components, and offering excellent thermal conductivity properties. Many times they are also used to protect the intellectual property on the electronic component being manufactured.

Potting and encapsulation are typically used in applications where electronic components such as circuit boards, microelectronics, sensors, connectors, power supplies, transformers and LEDs require protection against moisture, dust, and other environmental factors. We have listed some of the common industrial applications below:

• Aerospace: To protect critical electronic components in space such as, avionics, navigation systems, radar systems, and military equipment from harsh operating conditions, including high temperatures, shock, vibration, and moisture.
• Medical: To protect medical equipment and devices, such as implants, diagnostic equipment, and electronic components, against bodily fluids, sterilisation processes, and external contaminants.
• Automotive: To safeguard electronic components from harsh automotive environments, including protecting control units, sensors, ignition systems, lighting modules, and other electrical components from moisture, vibration, temperature variations, and chemical exposure.

The temperature a potting compound can withstand depends on the properties of the formulated compound; a high temperature resistance compound from Kohesi Bond can withstand up to 450°C (842°F). Alternatively, our cryogenic compatible epoxy compounds can withstand temperatures as low as 4K (-269.15°C).

Potting compounds are typically designed to provide a barrier that prevents moisture from penetrating and damaging the electrical device. So, If you are looking for a moisture-resistant potting and encapsulation compound, get in touch with us. We can custom engineer a potting compound that meets your requirements.