Bonding Application
Kohesi Bond manufactures an extensive range of epoxies for bonding similar and dissimilar substrates. Our one and two component adhesives can bond over small and large surface areas and offer first-rate adhesion. Our bonding epoxies can be cured at room temperatures as well as elevated temperatures and offer a broad range of cure times to suit your requirements. They are available in different hardnesses, viscosities and working times. These mechanically strong adhesives are typically used to bond various metals, ceramics, glass, plastics, rubbers and composites. In addition, our products offer excellent dimensional stability, very low shrinkage and can withstand temperatures over a wide range. Kohesi Bond adhesives are well known in the electronics, medical, food, optical, chemical and oil and gas industries. We can customize each adhesive to meet your specific end requirements.
Popular Products
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KB 1040-2
KB 1040-2 is a low viscosity, optically clear epoxy system that cures readily at room temperature. In addition, it is capable of passing NASA standards for low outgassing (ASTM E-595). Also, it offers excellent resistance to a variety of acids, bases, oils, fuels and water.
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TUF 1621 AOHT
Kohesi Bond TUF 1621 AOHT is a two component, room temperature curing epoxy system suitable for bonding and sealing. It is capable of passing NASA standards for low outgassing (ASTM E-595) and has a convenient 1:1 (Part A: Part B) mix ratio by weight or volume. This unique epoxy system offers remarkable toughness and superior peel strength.
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TUF 1820 AOHT
TUF 1820 AOHT is a toughened single component system that offers very good thermal conductivity and it is cryogenically serviceable. Owing to its stunning mechanical strength properties (tensile lap shear strength of > 3,800 psi), it is commonly used for bonding and sealing applications.