KB 1372 LP

Kohesi Bond KB 1372 LP is a two component, heat curing epoxy system suitable for bonding, sealing, coating and encapsulation. It has a favorable 100:25 (Part A: Part B) mix ratio by weight. This unique epoxy system offers remarkable adhesion to a variety of substrates, such as metals, composites, glass, ceramics, most plastics and rubbers. It offers a long working life at room temperature of over 12 – 24 hours and cures quickly at elevated temperatures. It can be cured easily by adding heat at 60°C – 70°C for 8 – 10 hours or 80°C – 100°C for 60 – 90 minutes or 125°C for 30 – 60 minutes. In order to optimize its performance properties, it is highly recommended to post cure at 100°C – 150°C for 3 – 4 hours.

KB 1372 LP is specially formulated for resistance to harsh chemicals. It can hold up to many aggressive chemicals, including water, fuels, oils, solvents, acids and bases. Additionally it is optically clear and cures rigid. This superior adhesive fosters outstanding physical strength and electrical insulation properties. It offers very low shrinkage upon cure and excellent flow properties. KB 1372 LP is widely used in optical, optoelectronic, electronics, fiber-optic and aerospace industries, where optical clarity, low exotherm and chemical and high temperature resistance are key requirements.