To protect sensitive electronic components from harsh environments such as shocks, vibration, and dust, potting and sealing are performed on the components. This works alongside other protective techniques, such as conformal coating and bonding. Potting a complete electronic assembly with a solid or gelatinous substance prevents shock and the electronic component from dust, moisture, and other environmental factors. With the growing needs of the electronics industry, the challenge to protect and secure the epoxy potting for critical components is extremely important. Our products are used for potting epoxy electronics and various microelectronic components, such as sensors, motors, coils, transformers, capacitors, switches, connectors, power supplies, and cable harnesses among others.

What Are The Benefits Of Potting And Sealing Of Electrical Components?

Electrical components, if left unprotected, can lead to damage from mechanical factors. To protect from these risks application of sealing and potting to electronic components is important. Here are some more benefits:

Benefits of Potting:

• Protection against moisture and electrical insulation
• Protection against thermal and mechanical shock and vibration
• Protection against corrosive agents
• Improved thermal conductivity
• Improved mechanical strength
• Improved chemical resistance
• Reduced noise and vibration
• Improved reliability and durability

Benefits of Sealing:

• Protection against dust, debris, moisture, and other environmental factors
• Improved reliability and durability
• Reduced noise and vibration
• Improved thermal management

Types of Potting and High-Performance Sealing Compounds

Potting and sealing compounds are available in different types, each with its unique properties and characteristics. Here are a few of them:

1. Epoxy Potting Compounds:

This is the most popular and common type of potting compound for electronic components. The compound offers excellent adhesion, chemical resistance, and mechanical strength, which is ideal for applications requiring strength, resistance to high temperatures, and good electrical insulation. Kohesi Bond is an expert in providing epoxy-based potting and encapsulation compounds.

2. Polyurethane Potting Compounds:

Polyurethane compound offers flexibility, toughness, and impact resistance, making them ideal for applications that require good thermal shock resistance, low-temperature flexibility, and good adhesion to various substrates.

3. Silicone Potting Compounds:

Silicone-based electronic potting compounds provide maximum levels of elasticity and the least level of mechanical strength. They can withstand high temperatures, up to approximately 200°C,  making them ideal for applications that are exposed to condensation or humidity, and can withstand electrical shock and extreme temperatures.

What Are The Requirements Of A Potting/Sealing System?

The potting or the sealing system has a few sets of requirements bases which they carry out their functionality;

• Superior dimensional stability
• Low exotherm
• Long working time
• Low shrinkage
• Stress-free cure
• Good thermal management
• Excellent electrical insulation properties
• Superior moisture resistance

Advantages of Choosing Kohesi Bond Potting Systems:

Our adhesives and sealants for electronic devices meet the highest quality standards. Also, they are capable of passing various industrial certifications such as NASA standards for low outgassing (ASTM E-595) UL 94 V-0, and FAR 25.853 (a)for flame retardancy.

A few of the other advantages that make us a good choice are:

• Thermal conductivity
• Good flow properties
• First-rate dielectric properties
• Low exotherm
• High glass transition temperature (Tg)
• Phenomenal chemical resistance
• Capable of passing the USP Class VI Biocompatibility test

Techniques for Applying Potting and Sealing Compounds

To ensure that the electrical potting and sealing process becomes successful, start preparing components while ensuring that they are free from dirt, grease, and other contaminants. The compound must be compatible with the materials of components and can be applied by brushing, pouring, or spraying. On the other hand, air bubbles in the potting compound can create gaps, which might allow moisture to enter and cause component failure. These bubbles can be removed either by vibrating the components or using a vacuum pump.

To make the process easier and more efficient, use the right tools and equipment while following the manufacturer’s instructions. Do not rush the process or you may end up with voids or other defects in the potting compound. Once the process is complete, test the components to make sure they are functioning correctly.

Conclusion

Protect your electronic device’s longevity and performance by investing in reliable protection such as potting and sealing of electrical components. The materials and application techniques ensure protection against moisture, dust, vibration, and shocks.

Get in touch with Kohesi Bond today and let us provide you with potting and sealing solutions that will safeguard your electronic components and keep them performing at their best.