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With an innovation-driven culture, Kohesi Bond distinguishes itself by its capacity to manufacture industry-ready adhesives, sealants, coatings, potting and encapsulation compounds, customized for every application. We send out weekly newsletters to keep you up-to-date with our latest developments, technical tips, white papers, articles and how-to videos. Find yourself at the forefront of technological evolution by subscribing to our newsletters!
ENHANCING ELECTRICAL INSULATION PROPERTIES OF EPOXIES 24 August 2017

Epoxies are inherently excellent electrical insulators. Adhesives, sealants, coatings, potting, encapsulation and impregnating compounds are widely employed in electronic and electrical applications. Choosing the right epoxy not only depends on its dielectric properties, but also on a number of properties such as temperature resistance, mechanical strength, chemical resistance and resistance to thermal and mechanical shocks and cycles.

INFOGRAPHIC 06 April 2017

Discover our space approved epoxy system KB 1631 HTC-1 with the help of this infographic. It offers phenomenal thermal conductivity, cryogenic serviceability and it is capable of passing ASTM E-595 NASA standards for low outgassing.

ARTICLE: FILLERS FOR EPOXY RESINS 30 March 2017

In addition to resins and curing agents, fillers are the most common ingredient in an adhesive formulation. Depending on the type of filler employed, it can have varied effects on the epoxy system. They can improve machinability, mechanical strength properties, corrosion resistance, thermal stability, abrasion resistance and dimensional stability. Specific fillers are capable of providing exceptional flame retardancy, heat dissipation properties and electrical conductivity.

Technical Tip: Enhancing Electrical Insulation Properties for Epoxies 23 March 2017

Epoxies are inherently excellent electrical insulators. Adhesives, sealants, coatings, potting, encapsulation and impregnating compounds are widely employed in electronic and electrical applications. Choosing the right epoxy not only depends on its dielectric properties, but also on a number of properties such as temperature resistance, mechanical strength, chemical resistance and resistance to thermal and mechanical shocks and cycles.

Case Study: Bonding Electronic Components Using Fast Curing Adhesives 10 August 2017

The customer wants to bond sensitive electronic components to a printed circuit board (PCB). The adhesion needs to be fast curing, dimensionally stable, withstand high temperatures and resist chemicals. In order to recommend the right solution, our technical expert needs to find out answers to certain questions pertaining to the customers application: